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ADT 7200 DICING SYSTEM
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With
new architecture and advanced process control tools, the 7200 models
deliver substantially higher productivity compared to existing dicing
systems, while minimizing the cost of operation. The system offers a
wide range of advanced automation and process monitoring options to meet
the requirements of your most challenging dicing applications: |
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Silicon |
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Glass on Silicon |
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MEMS |
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GaAs wafers |
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Package Singulation (BGA & QFN) |
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LTCC |
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PCB |
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Hard Materials |
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STANDARD FEATURES |
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Unique Wx3
wafer handling system streamlines wafer flow for greater
productivity |
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Continuous digital magnification vision System provides optimal
magnification for any eye-point |
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Special agorithm predicts blade wear rates to reduce height
measurement time and increase UPH |
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Touch panel display supports a user-friendly graphical interface
(GUI) |
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Atomized wafer cleaning technology for superior process results |
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Dedicated dressing cassette enables automatic blade dressing |
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Built-in Inspection tray allows for in-process quality assessment |
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ADT 7200
DICING SYSTEM |
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The
7200 Series is offered in three configurations optimized for IC
applications, package singulation or hard material applications. |
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ProDice |
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2"-3", DC-brushless, 1.2 kW, Air-bearing, 60 krpm spindle system,
optimized for IC applications. |
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TECHNICAL NOTES |
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Get
the
MODEL 7200
product
catalogue
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MegaDice |
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2"-3" High-torque, DC-brushless, 2.4 kW, Air-bearing, 60 krpm
spindle system, optimized for package singulation and IC applications |
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TECHNICAL NOTES |
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Get
the
MODEL 7200
product
catalogue
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GigaDice |
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4"-5" High-torque, DC-brushless, 2.5 kW, Air-bearing, 2.5 kW,
30 krpm spindle system, optimized for automated dicing of hard
materials. |
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TECHNICAL NOTES |
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Get
the
MODEL 7200
product
catalogue
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DICING BLADES, FLANGES & ACCESSORIES |
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ADT offers the
industry's most extensive catalog of dicing blades in an unlimited
combination of diameters, thicknesses and geometries.
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to the
DICING BLADE webpage |
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