 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
ABOUT ADT
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
ADVANCED DICING TECHNOLOGIES LTD.
is a
world leader in the development and manufacture of dicing saws and laser
scribing systems, dicing blades and processes used in the dicing of
silicon-based ICs, hard material Microelectronic Components (MECs) and in
package singulation.
ADT offers dicing equipment with a variety of capabilities and levels of
automation to suit an ever-growing range of customer requirements. Combining
our dicing equipment and annular dicing blades, we bring our customers a
complete range of dicing solutions. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
COMPANY BACKGROUND
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
ADT was
founded in August 2003 by a group of investors that bought the dicing
equipment division and blade division of K&S. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
DICING SYSTEMS |
 |
 |
 |
AUTOMATIC DICING SYSTEMS |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
ADT 7100 SERIES
With four different models to choose from, each optimized for a specific
range of applications, the 7100 Series covers the full spectrum of dicing
materials from IC wafers to package singulation and hard material
application. |
 |
 |
 |
 |
 |
 |
 |
ADT 7200 AUTOMATIC
SYSTEMS
The 7200 Series is offered in three configurations optimized for IC
applications, package singulation or hard material applications. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
NEXT STEP LASER SCRIBING SYSTEMS |
 |
 |
 |
DICING TOOLS & ACCESSORIES |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
NEXT STEP
ADT’s
NextStep
system
removes only non-silicon elements from the streets leaving the silicon wafer bare and virtually unaffected. The wafer can then be diced using a standard
mechanical dicing process. |
 |
 |
 |
 |
 |
 |
 |
DICING TOOLS
ADT
offers the
industry's most extensive catalog of dicing blades in an unlimited
combination of diameters, thicknesses and geometries. Grit size,
concentration, and bond hardness are optimized for a wide variety of hard
and brittle material applications. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
PERIPHERAL EQUIPMENTS |
 |
 |
 |
ADT INFO PAGE |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
PERIPHERAL
EQUIPMENTS
a broad range of peripheral equipment to complement ADT
Dicing Saws: Wafer mounting station, Tape curing system, Wafer cleaning
station, Spindle coolant recirculation, DI water ionizer, Closed-loop
filtration of cutting water and
Frames &
Cassettes |
 |
 |
 |
 |
 |
 |
 |
INFO PAGE
The ADT Information page have all the brochures over
dicing systems and blades & accessories etc.. You can as well find technical
notes and other valuable information.
|
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |