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ASM EAGLE339
SERIES HIGH
SPEED AUTOMATIC BALL BONDER
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The
Eagle is designed to meet today's equipment needs for higher speed
production of more difficult devices.
The Eagle easily accommodates the demanding and ever-tightening
specifications on fine pitch requirements, long wires, low loop height,
multi-tier looping, stacked die and more. |
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EAGLE 339 |
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339
thermosonic wire bonder |
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THERMOSONIC WIRE
BONDER |
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Gold wire diameter – 15 to 76 microns |
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35 µm
ultra fine bond pad pitch capability |
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60+ ms
ultra high bonding speed for 2 mm wire length |
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Up to 33K
UPH for chip LED with PR look ahead |
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Total
yield control |
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Advanced
loop control |
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Enhanced
EFO control systems |
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Enhanced
optics with on-line inspection |
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Host
communication for factory automation |
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Eagle60-01
is for single reel leadframes |
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EAGLE 339XL |
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339XL for
"hybrid" applications |
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ULTRA HIGH SPEED
BONDER FOR HYBRID APPLICATIONS |
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One pass solution for large bond area packages
e.g.
standard ceramic of 4” x 4”, chip on board,
printed circuit and multi-chip modules. |
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Largest
bond area of 88 mm Y-bondable distance |
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Compact
and low inertia digitally controlled bond head with built-in
features |
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Ultra fast
speed up to 8 wires/sec with extreme precision |
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Advanced
loop algorithm with superior looping
trajectory
profile, auto-tuning technology |
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Bond
process monitoring with post-bond
inspection, free air ball formation monitoring and
non-stick detection monitoring |
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EAGLE 339-02 |
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339-02 for
"display/bent leadframe" applications |
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AUTOMATIC GOLD WIRE
BALL BONDER |
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Specially designed for 7 segment
display/
bent leadframe applications |
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Comprises
all standard features of Eagle60 |
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Conversion
of window clamper and top plate for different leadframe packages |
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High
performance PR with
MMX
technology |
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Unique
dual path optics applicable to wider range of packages |
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LED
controlled lightings |
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EAGLE 339-03 |
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339-03 for
"optoelectronic" applications |
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AUTOMATIC GOLD
WIRE BALL BONDER FOR OPTOELECTRONIC APPLICATIONS |
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Application includes vertical LED, photo transistors and
infrared diodes |
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PR look
ahead |
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High UPH
of 22K |
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Advanced
digital controlled bond head
with
built-in force sensor:
- Fast and
stable precise z-motion
- Stable
z-motion
- Low and
consistent impact force
- Fast
settling time of impact force |
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Automatic
simultaneous magazine transfer during bonding |
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Movable
heater block design to ensure precise fixture of LED (cup) during
bonding |
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Linear
motors and high-resolution encoders in work holder to achieve an
accuracy of ±3 μm @ 3 sigma |
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EAGLE 339CU |
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339CU "copper
wire" ball bonder |
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AUTOMATIC COPPER WIRE
BONDER |
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Specially designed copper kit
- Prevents
FAB from oxidation
- Produces
good ball roundness
- Consumes
less forming gas |
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Copper
wire diameter – 20 to 125 microns |
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Fine pitch
copper bonding |
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Heavy
copper bonding up to 5 mil |
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Unique
programmable feature, Stitch Bond Enhancer, which improves stitch
pull strength and resolves NSOL |
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ASM DUAL-HEAD
SERIES HIGH
SPEED AUTOMATIC BALL BONDER
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The
"Harrier" and "TwinEagle" are built on the Eagle platform to achieve
almost a double production throughput. The bonders are designed to meet today's equipment needs for
a even higher speed
production of more difficult devices.
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HARRIER |
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HARRIER
"dual bond head" ball bonder |
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DUAL BOND HEAD WIRE
BONDER |
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Ultra high
speed (1.9 times of Eagle60) |
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50 μm
BPP |
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Accuracy
of ±3.5 μm @ 3 sigma |
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Dual wire
size application |
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Dual wire
types: Au and Cu |
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Discrete
and low I/O ICs |
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Two
independent bonding stage and system |
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Support
different work holder indexing mode
- Left to
right magazine configuration
- In and
out from same magazine side |
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PR look
ahead to maximize the throughput |
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Single
path optics |
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TWINEAGLE
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TwinEagle
"dual bond head" ball bonder |
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DUAL BOND HEAD WIRE
BONDER |
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Ultra high speed (1.9 times of Eagle60)
35 µm
ultra fine bond pad pitch capability |
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Accuracy
of ±3 µm @ 3 sigma |
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Highest
output with smallest footprint |
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Independent 2-in-1 bonding system |
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Workholder-reverse
indexing |
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Dual wire
sizes |
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Dual wire
types: Au and Cu |
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Support
different work holder indexing mode
- Left to
right magazine configuration
- In and
out from same magazine side
PR look
ahead to maximize the throughput |
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