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ASM AD898 EPOXY DIE
BONDER
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The
AD 898 Epoxy Die Bonder for 8" wafers continues the path undertaken
by ASM to provide customers with the highest quality and best cost /
performance systems on the market. With its capability to handle up
to 8" wafers, fully automatic operation, Epoxy Writer, Pre & Post
Bond Inspection and Wafer Mapping, the AD 898 is able to provide the
customer with exceptional operational results. |
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AD898 |
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AD898 Epoxy
Die Bonder |
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AUTOMATIC DIE
BONDER |
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High accuracy
with excellent productivity:
- 320 ms system cycle time
- ±25.4 μm @ 3 sigma XY placement
- ±0.5° @ 3 sigma die rotation |
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Flexible
indexing clamp for substrate thickness of 0.1 to 2 mm |
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Real time epoxy
pattern inspection and alignment |
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Automatic
pre-bond and post-bond inspection
Die size range: 10 x 10 to 1000 x 1000 mil |
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Automatic wafer
handling system to handle up to 8" wafer |
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Flexible work
holder for different applications
Applications include Mini-BGA, Flex BGA,
- CSPBGA, MLP / QFN, QFP, TQFP, PLCC,
- TSSOP, TSOP, SOIC, SOT, PDIP, stacked
- CSP, Image sensor and singulated unit. |
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ASM AD8912/AD8912SD
EPOXY DIE BONDER
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The AD 8912 Epoxy Die Bonder for 12" wafers
continues the path undertaken by ASM to provide customers with the highest
quality and best cost / performance systems on the market. With its
capability to handle up to 12" wafers, fully automatic operation,
Epoxy Writer, Pre & Post Bond Inspection and Wafer Mapping, the AD
8912 is able to provide the customer with exceptional operational results. |
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AD8912/AD8912SD |
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AD8912 Epoxy
Die Bonder |
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AUTOMATIC DIE
BONDER FOR 12" WAFERS |
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AD8912SD
FOR STACKED DIE APPLICATION |
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Robotic wafer
handling system for wafers up to 12" |
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High accuracy with excellent productivity:
- 320 ms system cycle time
- ±25.4 μm @ 3 sigma XY placement
- ±0.5° @ 3 sigma die rotation |
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Die size range:
10 x 10 to 1000 x 1000 mil
Universal workholder conversion for various packages |
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Flexible
indexing clamp for leadframe / substrate thickness 0.1 to 2mm |
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2 to 4 mil thin
die bonding capability
Real time epoxy pattern inspection and position alignment |
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Applications
include Mini-BGA, Flex BGA,
- CSPBGA, MLP / QFN, QFP, TQFP, PLCC,
- TSSOP, TSOP, SOIC, SOT and PDIP |
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AD8912SD for
stacked die application |
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