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AD900/AD900TS HIGH
SPEED AUTOMATIC FLIP-CHIP DIE BONDER
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The
AD900 Flip-Chip Die Bonder for IC application is a new machine designed for customers running up to
8 inch
wafers. It provides the customer
with exceptional volume throughput with good placement accuracy. The AD900 is a further example of ASM's commitment to the customer for
continued improvements in reducing their assembly processing costs. |
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AD900/AD900TS |
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AD900
Flip-Chip
Die Bonder |
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FLIP CHIP
BONDER |
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THERMOSONIC
FLIP CHIP BONDER |
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Precise placement accuracy:
±10 µm @ 3 sigma |
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High
productivity:
- 0.6
sec/cycle (without up-looking inspection)
- 0.8
sec/cycle (with up-looking inspection) |
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Die size
range: 10 x 10 - 700 x 700 mil |
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Bond
force with real time
feedback
control |
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High
process flexibility:
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Flux dispensing via writer
system
- Flux dipping
- Input magazine for stencil
print |
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Convertible flip chip and die bonding process |
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AD900TS comes with
thermosonic
flip chip
capability |
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Placement
accuracy: 15 μm @ 3 sigma |
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ASM AD8912/AD8912SD
EPOXY DIE BONDER
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The
AD9012 Flip-Chip Die Bonder for IC application is a new machine designed for customers running up to
12 inch
wafers. It provides the customer
with exceptional volume throughput with good placement accuracy. The AD9012 is a further example of ASM's commitment to the customer for
continued improvements in reducing their assembly processing costs. |
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AD9012 |
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AD9012
Flip-Chip Die Bonder |
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FLIP CHIP
BONDER |
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Robotic wafer
handling system for wafers up to 12" |
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Precise
placement accuracy: ±10 μm @ 3 sigma |
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High
productivity:
- 0.6 sec/cycle
(without
up-looking inspection)
- 0.8 sec/cycle
(with
up-looking inspection) |
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Die size range:
10 x 10 - 700 x 700 mil
Real-time bond force control with feedback system |
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High process
flexibility:
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Flux dispensing via writer system
- Flux dipping |
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Convertible
flip chip and die bonding process |
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Applications
include flip chip bonding
- on leadframe, BGA, ceramic substrate,
- singulated unit |
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ASM AD819-11A/AD819-11TS
HIGH PRECISION FLIP CHIP BONDER
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The
AD819-11A High Precision Flip-Chip Die Bonder for IC application is a new machine designed for
high precision die placement. The AD819-11A is a further example of ASM's commitment to the customer for
continued improvements in reducing their assembly processing costs. |
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AD819-11A/AD819-11TS |
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AD819-11A
High Precision Flip-Chip Die Bonder |
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HIGH PRECISION
FLIP CHIP BONDER |
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THERMOSONIC
FLIP CHIP BONDER |
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XY placement:
±10 µm |
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Die rotation:
±0.5° |
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0.7 sec cycle
time |
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Linear bond
head with 3-phase θ axis |
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Submount on
work holder XY table |
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Configurable
bonding process: Flux/ epoxy stamping system |
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Up-looking
optics for precise die alignment |
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Applications
include precision flip chip die attach e.g. LD on submount and high
brightness LED |
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AD819-11TS
comes with thermosonic flip chip capability:
- Placement accuracy: ±1 μm @ 3 sigma |
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ASM AD819-12A
HIGH PRECISION FLIP CHIP BONDER
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The
AD819-12A High Precision Flip-Chip Die Bonder for IC application is a new machine designed for
high precision die placement. The AD819-11A is a further example of ASM's commitment to the customer for
continued improvements in reducing their assembly processing costs. |
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AD819-12A |
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AD819-12A
High Precision Flip-Chip Die Bonder |
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HIGH PRECISION
FLIP CHIP BONDER |
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XY placement :
±10 µm |
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Die rotation :
±1° |
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Linear bond
head with 3-phase θ axis |
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Bond force
range: 30 - 150 g |
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Submount on
work holder XY table |
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Configurable
bonding process: Flux/ epoxy
stamping system |
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Down-looking
optics for precise die alignment |
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Precise moving
flipping mechanism:
- X resolution: 0.5 μm
- Y resolution: 0.625 μm |
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Optional
non-flip bonding capability with up-looking inspection |
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Applications
include precision flip chip or die attach on submount e.g. LD on
submount and high brightness LED |
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ASM SR900 FLUX REFLOW
OVEN
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The SR900 Flux Reflow Oven designed for in-line
solder paste
reflow, eutectic solder paste reflow, epoxy curing, snap-cure epoxy
curing, etc..
The SR900 is a further example of ASM's commitment to the customer for
continued improvements in reducing their assembly processing costs. |
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SR900 |
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SR900 Flux
Reflow Oven |
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FLUX REFLOW
OVEN |
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Maximum reflow
temperature: 400 °C |
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Dynamic
temperature profile with 7 heating zones |
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Support both IR
and convection heating modes |
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High
temperature resistant stainless steel conveyor belt |
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Inert
atmosphere for oxidation-free reflow condition and the use of
low-activity flux |
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In-line
capability |
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Applications
include high lead (>85% Pb) solder paste reflow, eutectic solder
paste reflow, epoxy curing, snap-cure epoxy curing, etc. |
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