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The following tables show the maximum wire loop height that may be
used with a known Capillary "T" size at a known bond pad pitch. The tables have
been calculated for 0.0005in./13 micron clearance between a 10° angle bottleneck and the
adjacent wire loop for 0.0010in./25 micron and 0.0013in./33 micron wire.
Bonding with higher loop heights (or larger T sizes) may be attempted with highly accurate
bonders, or if minor touching of the loops by the capillary is acceptable.
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A helpful ratio to use in planning in conjunction with the
clearance tables is that for each additional 0.0010in./25 micron of loop height, the
distance between the 10° angle bottleneck and the wire closes by 0.0001in./2.5 micron.
Example: Per the table a 10° angle
bottleneck capillary with a T=0.0060in. used in 0.0050in. pitch, 0.0010in. wire bonding
situation will have 0.0005in. clearance with a 0.011in. loop. If the loop height were
increased to 0.014in. the wire to capillary clearance would be reduced to 0.0002in.
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