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ABOUT HYBOND
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Hybond
Inc.
Manufactures equipment
specifically designed for assembly of electronic products. Their current customers include
manufacturers of microwave, semiconductor, and hybrid components as well as hard disks,
coils and miniaturized transformers. |
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PRODUCT OVERVIEW
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Hybond offers wire bonders, die attach machines, work stages,
bonders for insulated wire, dynamic force measurement equipment and specialized equipment
for unique assembly requirements. Their line of equipment includes both manual and
semiautomatic capabilities and is oriented toward those companies whose applications do
not require high speed, high cost automatic equipment. They pride themselves
on
flexibility and customer service and will respond to new and unique
application or requirements for
equipment that they do not yet manufacture. Hybond is prepared to answer any questions that our
customers or prospective customers may have regarding their products. |
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BALL BONDERS |
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WEDGE BONDERS |
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Model
522A and 522A-40 Bonders,
Hybond Manual Ball Bonders, sets the industry standard for ease of operation and
maintenance. Front panel operator controls include force, bond time,
ultrasonic energy, tail length, EFO. |
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Model
572/572A-40 and 676,
Two wedge bonder designs available, digital and
analogue
Model 626
Multipurpose
Deep Access, Long Reach Wire Bonder that can operate as a Ball, Wedge, Bump
or Peg bonder. |
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PEG BONDERS |
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Model
616-Series Peg Bonders,
Model 616-Series performs ultrasonic attachment
of insulated or un-insulated wire/ribbon. It also is used for ball coining,
ribbon-tacking, pin-tab bonding, and mesh bonding. |
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