BITA  Nordic News Page

NEW SEMI-AUTOMATIC PICK & PLACE DIE BONDER FROM JFP.  

JFP has released a a new Semi-Automatic Pick & Place Die Bonder. The system is built on the JFP DB5 platform with an improved motorized table, featuring a resolution of 1µm (X,Y). Bond force is programmable from 15 g up to 500 g. A range of process options are available. 

BEIJERT NOW HAVE A LINE OF ACCESSORIES AND MOTHERBOARD CARDS   

This November BEIJERT ENGINEERING started to offer a line of accessories and motherboard cards for PROBE CARD Testing. 

JFP MICROTECHNIC
The company have been acting in the microelectronic industry for more then 15 years. The key personal have 25 years of experience and as a result of market demand developed a line of manual machines for unique applications.  

BEIJERT ENGINEERING
Beijert Engineering designs and manufactures a diversified product line of motherboards, load boards, test interfaces and custom printed circuit boards. Motherboards used in conjunction with probe card analyzing Manager, Supervisor XL or others equipment are a critical and necessary component to measure probe card correlation and performance prior to production wafer testing, minimizing tester downtime and increasing yields.

PP-5  
The PP5 is a Semi-Automatic Pick & Place Die Bonder designed for the precise placement of delicate devices on a substrate or package. The PP5 utilizes a robust and reliable mechanical concept, designed to be extremely stable and vibration free. 

Biejert Engineering
Beijert Engineering provides and designs a number of ancillary products for probcard testing, storing and analyzing.