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XYZTEC CONDOR MULTIFUNCTIONAL BOND
TESTER
XYZTEC B.V. has developed the most advanced multifunctional
pull and shear bond tester available in the market. With the choice of a
single or revolving measurement unit head, you will have an advanced system
meeting basically all your quality requirements for wire, stud and/or die
bonding.
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It
shears a complete BGA array in one time to verify the breaking surface of
the ball on substrate. It is important to know that on BGA a lot of
end-users are asking for this new test. XYZTEC has designed a special Condor
100-3 in cooperation with ST Microelectronics. The Y (shear) axis has extra
high shear speed till 20 mm/sec., with a special customized Y motor. XYZTEC
has so far installed 6 systems to ST Microelectronics plants worldwide.
Until now no one can do this test except XYZTEC. Basically, all the BGA
producers are looking for a tester which can do total ball shear. XYZTEC can
do this test and already have experience. Feel free to contact us for
detailed questions.
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