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PRODUCT
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BOOTH AND CONTACT
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JFP
Microtechnic
JFP will show the PP5,
Monozoom & Epoxy & Eutectic & Wafersystem as well as the PP1
system. |
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Hall 9
Booth 144 |
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Contact:
François Palomares and Didier Magne,
JFP will show their machines
in the booth of Micronnect BV. |
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GTC
Gaiser Tool Company (now CoorsTek) invented the first alumina ceramic capillary,
revolutionizing wire bonding. Since that time, Gaiser Tool Company has
become the industry leader. |
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Hall
7
Booth 226 |
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Contact: Brigitta Wrana
She will help you in choosing the best tool for your application. |
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TPT
HB05
HB05 is the latest updated bench top size manual wire bonder from TPT, easy to operate and ideal for laboratories, pilot
and pre-production runs and small scale production lines. |
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Hall 7
Booth 104 |
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Contact: Franz Hickmann
or Michael Gross
TPT displays their product line of wire bonders,
including the new HB05 and H80, "Pick & Place/Die Bonding option for Model
HB16. |
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UNITEMP
Have a line of Thermal Process ovens which are excellent for laboratory and
pre-production requirement. |
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Hall 7
Booth 104 |
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Contact: Astrid Schmid and
Peter Hoffmann.
Note: you will find UniTemp in the booth of TPT/Amadyne
with some of their products, (RSO-650, HP-155 and HP-60). |
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WILLIAMS_ADVANCED_METALS
Vapor deposition
materials, backing plates and PVD accessories to bonding wire, frame/lid
assemblies, solder and brazing materials. |
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Hall
7
Booth 226 |
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Contact:
John Regan
Williams will be present by their German representative, Dage. WAM
is exhibiting Combo Lids, bonding wire, preforms and PVD products |
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XYZTEC
Multifunctional
Bond Testers with an innovative mechanical design.
Motorized X, Y Z stage 190 mm travel on all models. Controlled by
two ergonomically designed joysticks |
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Hall 7
Booth 225 |
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Contact: Dirk Schade
XYZTEC will exhibit their Model Condor EZ and 150-3 Bond Testers. |
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For more information contact:
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