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HYBRID GROUP |
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DESCRIPTION |
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ACCUPROBE
Probes,
Probe Cards,
Equipment and
TechInfo |
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High performance probing and interface products for use in the
testing of integrated and hybrid circuit. |
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ADT
7100 Series Dicing System,
7200 Automatic Dicing System,
8000 Next Step Laser Scribing System,
Dicing Blades & Accessories,
Periphial Equipment, |
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ADT is a
world
leader in the development and manufacture of dicing saws and laser scribing
systems, dicing blades and processes used in the dicing of silicon-based
ICs, hard material Microelectronic Components (MECs) and in
package singulation. |
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AEROFEED
Vari-Cab, WPS, and NRC-300/RSC-100 |
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Nitrogen Storage Cabinets, for chip devices, waffle packs, bonding
wire, bonding tools and SMT components. |
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ASM
PACIFIC TECHNOLOGY
Wafer Bump, Die Bonders,
Ball Bonders, Wedge
Bonders
Flip-Chip
Bonder, |
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ASM
is today the world’s number one assembly equipment manufacturer. We have
focused on the their line of Wafer Bump, Die-, Flip-Chip, Wire Ball/Wedge Bonders. |
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AUER
Products, Service |
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Film Frames, Flat Carriers, Magazines, Cassettes and Process
Carriers. |
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AUREL
In-line,
Automatic |
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AUREL Automation is
specialized in manufacturing of automation systems for electronics industry:
Screen
stencil printers, laser trimming, handling for printed circuit board. Dryers
and ovens furnaces. |
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BEIJERT
ENGINEERING
Supervisor, Manager
Technician, Pathfinder |
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Probe card verification and management system for the production
environment. |
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C+L DEVELOPMENT |
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Handling Systems for Magazines, Cassettes and Process Carriers. |
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GAISER
Products,
Information |
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Capillaries, Small Wire Wedges, Large Wire Wedges, Single Point
T.A.B. Tools, Gap Welding Electrodes, Die Collets & Vacuum Pick-up Tools and Solder
Reflow Tools. |
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GLEN TECHNOLOGIES
News, Products |
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Plasma Cleaning Systems for
Hybrid Circuits, Semi-conductor Wafers, Flat Panel Plasma Displays as well as in-line
equipment for automatic production applications. |
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HYBOND
Ball Bonders, Wedge Bonders,
Peg Bonders |
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Manual and semi-automatic PEG/TAB/BEAM-LEAD, Ball, Wedge and
Ribbon Bonding Machines. |
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JFP
MICROTECHNIC
Products |
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Manual
Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and
Break System for sensitive devices. |
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RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell |
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Near Infrared Furnace Systems for the Hybrid/Thick Film
Applications, Wafer Bump and MCM/Flat Panel Production. |
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STRATUS
VISION |
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Various Inspection Systems for the Thick-Film Hybrid Production. |
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TPT
TECHNICAL PRODUCT TRADE
HB02-05 Series Manual Bonder
HB08-10 Series Semi-Automatic Bonder
HB12-16 Series Semi-Automatic Bonder |
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The
HB-Series of bench top size wire bonders are easy to operate and ideal
for laboratories, pilot and pre-production. One Bond head for wire and
ribbon bonding in Wedge or Ball bonding mode. |
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UNITEMP
Process Ovens, Reflow
Ovens,
Workstages/Workholders, Hotplates,
Accessories and Bond Pull
Tester |
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Thermal Process ovens for laboratory and
pre-production requirement. Hotplates/workstages (workholders). A smart wire spooler
with microcontroller for Bonders. Tool Heater and temperature
controllers. Bond Pull
Tester for destructive/ non-destructive pull tests |
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UTHE
Generators, Transducers,
Negative EFO and Bond Monitor |
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Ultrasonic power supplies and transducers, bond monitoring
systems, and other bonding equipment peripherals used in semiconductor assembly and
testing |
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WILLIAMS
ADVANCED MATERIALS
Vapor Deposition, Lids,
Bonding
Wire, Packaging Materials, Solder
Alloys and Contact Alloys |
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Vapor Deposition Products,
Bonding Wire and Ribbon, Hermetic Lids, Solder and Electrical
Contact Alloys |
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XYZTEC |
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Multifunctional Bond Testers; for
Wire Pull, Ball Shear,
Wedge Shear, Solder Ball Shear and Die Shear. |
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HYBRID
LINKS
IMAPS, IMAPS Nordic |
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Links to Hybrid web sites. |
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