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BOOTH AND CONTACT
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ADT
is
a world leader in the development and manufacture of dicing saws and laser
scribing systems, dicing blades and processes used in the dicing of
silicon-based ICs, hard material Microelectronic Components (MECs) and in
package singulation. |
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Hall
B2
Booth 382 |
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Contact:
Yossi Gershon (for Dicing Systems) and
Ms. Miri Benita will help you with Dicing Blade questions.
ADT is exhibiting their
Semi Automatic dicing system Model 7900 using two facing spindles. |
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PRODUCT
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BOOTH AND CONTACT
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ASM
ASM Assembly Products
will show their new Model
MCM12 – Automatic
Multi Chip Module Bonder.
ASM is today the industry leader in Automatic
Bonding and assembling equipment and systems . |
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Hall
A3
Booth 480 |
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Contact: Angelo Cenec and Augustin Schervan will
be at the booth for your assistance. |
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PRODUCT
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BOOTH AND CONTACT
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AUREL
AUREL Automation is
specialized
machines for material deposition and creation of precision-patterns. Screen
stencil printers, laser trimming, handling for printed circuit board. Dryers
and ovens furnaces for automatic production lines. |
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Hall A2
Booth 481 |
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Contact: Nerio Samori
Screen printers , stand alone, in-line, for thick film, LTCC, green
energies, sensors. Lasers for trimming, marking, cutting. Work Cell for
ink-jet of nano materials, microdispensing, DOD, inspections. |
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PRODUCT
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BOOTH AND CONTACT
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JFP
Microtechnic
Very new is the Model PP400 semiautomatic and PP400M manual Die Bonder,
(however not shown at the exhibition, but could be discussed at the booth). |
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Hall A4
Booth 144 |
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Contact:
François Palomares and Didier Magne,
JFP will show their Model
PP5-6 Flip-Chip die bonder and PP-One, manual die placement. |
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PRODUCT
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BOOTH AND CONTACT
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TPT
HB05 is the latest updated bench top size manual wire bonder from TPT, easy to operate and ideal for laboratories, pilot
and pre-production runs and small scale production lines. s |
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Hall B2
Booth 183 |
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Contact: Franz Hickmann
or Michael Gross
TPT displays their product line of wire bonders,
including the new HB05 and H80, "Pick & Place/Die Bonding option for Model
HB16. |
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PRODUCT
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BOOTH AND CONTACT
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UniTemp
Thermal Process ovens
for laboratory and
pre-production requirement. Hotplates/workstages (workholders). The BT Bond
Tester is probably, the lowest cost destructive/ non-destructive pull
tester in the market. |
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Hall A4
Booth
144 |
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Contact:
Wilhelm Bachmann and Astrid Schmid
UniTemp
will exhibit their UTP-1100,
RTP-1200, Hot Plates (workstages/ workholders), RSS-350, Leak detector and
the BT Bond Pull Tester. |
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PRODUCT
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BOOTH AND CONTACT
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MATERION ADVANCED MATERIALS
Vapor deposition
materials, backing plates and PVD accessories to bonding wire, frame/lid
assemblies, solder and brazing materials. |
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Hall A4
Booth 136 |
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Contact:
Simon Osborn
Materion Advanced Materials will be by their German representative, Dage. WAM
will exhibiting Combo Lids, wire, preforms and PVD products |
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PRODUCT
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BOOTH AND CONTACT
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XYZTEC
Multifunctional
Bond Testers with an innovative mechanical design.
Motorized X, Y Z stage 190mm travel on all models. Controlled by
two ergonomically designed joysticks |
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Hall
A2
Booth 221 |
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Contact: Dirk Schade
XYZTEC will exhibit their Model Condor 150-3 Bond Tester. |
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