TPT-HB10 Semi-Automatic Digital Wedge/Ball/Bump Bonder



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TPT SEMI-AUTOMATIC BONDERS

WITH MOTORIZED Z-AXIS

Model HB06, HB08 and HB10 Series of bench top size semi-automatic wire bonders with motorized Z-Axis are easy to operate pilot pre-production runs and small-scale production lines. One Bondhead (HB10) for bonding in Wedge/Wedge, Ball/Wedge or Bump bonding mode. No hardware change necessary (HB10). Direct access and simple adjustment to all bond parameters.

STANDARD FEATURES

HB06, HB08 and HB10 Series Semi-Automatic Wire Bonders

	90� Bonding Deep-Access Bond Head
	Digital control with LCD Display
	PPL Ultrasonic Generator
	Programmable Loop Height
	Large Bonding Area
	Stitch and Bump Bonding
	20 Program Storage Capability
	Built-in Dual Fiber Optics Illuminator
	Built-in Heater Controller for Workholder
	Bond Arm Length 165 mm
	Motorized 2" Wire Spool
	Electronic Flame-Off and ball size control (for Ball Bonding)

OPTIONS

	H10 Zoom Stereo-Microscope Leica S6-20x
	H20 Built in Heater Stage Controller (up to 250�C)
	H21 100x100 mm square Adjustable Height Heated Workholder
	H26 60 mm round Adjustable Height Heated Workholder
	H29 90 mm round Adjustable Height Heated Workholder
	H50 Spotlight Targeting System
	H55 Dual Fiber Optics Illuminator
	H72 Wire Spool Adapter for 0.5" spool
	H73 Torque Wrench 25 cNm for exact tighten of bonding tool
	H83 External Heater Controller for Workholder
	H90 Delivery with installation and user training

INFORMATION

HB06 Wedge Bonder Data Sheet

HB08 Ball/Bump Bonder Data Sheet

HB10 Wedge/Ball/Bump Bonder Data Sheet

to TPT info page

WIRE/RIBBON CAPABILITY:

BONDHEAD:

for Al wedge bonding 17�m to 75�m wire

Deep-access (12mm)

for Au wedge bonding 17�m to 75�m wire

CONTROL OF 1ST AND 2ND BONDPARAMETERS:

for Au ribbon bonding max. 25�m x 250�m

Independent

for Au ball bonding 17�m to 50�m wire

BONDING OPERATION PROCESS:

for Au bump bonding 17�m to 50�m wire

Motorized Z axis (Bond Head)

	SPECIFICATION			HARDWARE

	Motorized Axis			Z-Axis (20mm)

	Ultrasonic System			PLL control 62 kHz transducer

	Wire Feed Angle			90� deep-access

	Bondarm Length			165 mm

	Control Panel			Digital LCD Display

	Loopheight and Profile			Programmable Loopheight

	Storage capacity			20

	Wire Termination			Bondhead Tear

	Wirespool handling			2 inch motorized

	Fine Table Motion			15x15 mm

	Mouse Ratio			6:1 ratio

	Ultrasonic Power			0- 2 W output

	Bond Time			15- 5'000 msec.

	Bondforce			15- 100 cN

	Heater Stage Controller			Built-in, 250� C max.

	Lighting			Built-in Dual Fiber Optic Illuminator

	Electrical Requirements			100- 240 V � 10%, 50/60 Hz, 10 A max.

	Physical Dimensions			600 mm W x 550 mm D x 500 mm H

	Weight			net 35 Kg

	Industry Standards			CE certified


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Send mail to tish.ward@bita.se with questions or comments about this web site. Copyright � 1998 BITA ELEKTRONIK SVENSKA AB Last modified: 2011-11-12

Send mail to tish.ward@bita.se with questions or comments about this web site.
Copyright � 1998 BITA ELEKTRONIK SVENSKA AB
Last modified: 2011-11-12