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UTHE GENERATORS |
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The
design of every Uthe
generator focuses on the metallurgical nature of wire bonding. With it's
field proven Frequency Control Module, Uthe generators provide users with
the flexibility and versatility demanded by today's bonding processes. |
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MODEL 10G, 20G, 40G, 50G GENERATORS |
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With
power outputs of 1, 5, 20, 40, and 50 watts, this family of generators
use the same Frequency Control Module as the standard 10G. These
generators are used for heavy wire bonding of power devices, single
point TAB applications, flip-chip bonding and die attach. When used with
Uthe's 8 crystal transducers, users can accommodate wire sizes from 4 to
20 mil. |
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G-SERIES SPECIFICATION AND OPTION |
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Go to the
G-SERIES specification
and option page |
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MODEL 10H GENERATOR |
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CUSTOMIZED GENERATORS |
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The model 10H generator represents Uthe's commitment to develop
advanced, high quality, cost-efficient products that meet the demanding
requirements of the semiconductor industry. Its dual processor design
provides the 10H with a form of artificial
intelligence for active control during the bonding process. Every
bonding application will benefit from the new features of this
generators: |
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The
following generators are customized versions of the Model 10G generator.
(consult first with Uthe) |
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Model 10KS, Used on Kulicke and
Soffa's 1471 and 1472 bonders |
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Model 10AS, For use with ASM wire
bonders |
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Model 10HY, Used on Hybond bonders |
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Model
10G - MA, For Matsushita bonders |
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Model 10 - SMH, For use with Shin Me
Hua bonders |
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Model
10H Generator |
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Model
VME Generator |
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Automatic
impedance sensingr |
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One
touch power calibration |
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Automatic
power adjustment during bonding |
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Real-time
frequency, impedance, power and phase measurement |
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Dynamic
frequency control module |
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Selectable
power ramping profile |
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High
frequency option |
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H-SERIES
SPECIFICATION AND OPTION |
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VME-SERIES
SPECIFICATION AND OPTION |
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Go to the
H-SERIES specification
and option page |
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Go to the
VME-SERIES specification
and option page |
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GENERATORS SUMMARY |
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Type |
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Max.
Output
Power* |
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Max. Bond
Time |
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Freq.
Range |
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Interface Control |
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Dimensions |
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Low
[W] |
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High
[W] |
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Short
[mSec] |
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Long
[mSec] |
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[kHz] |
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Bond Time |
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Bond Power |
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Height
[inch] |
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Width
[inch] |
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Depth
[inch] |
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10G |
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1.0 |
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5.0 |
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100.0 |
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1000.0 |
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55-139 |
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- 82,JS,RS |
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- 82,JS,RS |
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2.75 |
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10.00 |
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9.00 |
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20G |
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2.0 |
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20.0 |
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100.0 |
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1000.0 |
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55-65 |
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JS,RS |
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JS,RS |
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4.00 |
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12.00 |
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12.00 |
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40G |
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2.0 |
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40.0 |
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100.0 |
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1000.0 |
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55-65 |
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JS,RS |
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JS,RS |
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4.00 |
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12.00 |
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12.00 |
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50G |
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2.0 |
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50.0 |
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100.0 |
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1000.0 |
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55-65 |
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JS,RS |
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JS,RS |
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4.00 |
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12.00 |
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12.00 |
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10H-P2* |
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1.0 |
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2.5 |
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Interface
Contr. |
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55-165 |
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8-bit parallel |
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8-bit
parallel |
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2.5 |
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9 |
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7.5 |
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10KS |
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1.0 |
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2.5 |
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Interface
Contr. |
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55-65 |
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K&S Bus |
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K&S
Bus |
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Board
Level: K&S |
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10HY |
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1.0 |
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2.5 |
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Interface
Contr. |
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55-139 |
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Hybond Bus |
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Hybond
Bus |
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Board
Level: Hybond |
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P2-VME** |
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- |
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2.5 |
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Interface
Contr. |
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25-300 |
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VME bus |
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VME
bus |
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Board
Level: VME 6U,
2-slots |
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P2-PCI** |
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- |
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2.5 |
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Interface
Contr. |
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25-300 |
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PCI
Bus |
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PCI
Bus |
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Board
Level: PCI Half Size, 1-slot |
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* Rear Panel
Switch, ** External Supply Needed |
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