UNITEMP GMBH.

The Reflow Solder Oven RSO-650 is an excellent tool for various solder processes and other applications. Some applications are: as laboratory furnace for all kind of developers implementing and researching new processes, e.g. flux less soldering, flip-chip process, adhesive bonding, hermetic sealing under different controlled atmospheres, solder bump reflowing, encapsulation of housings, soldering of power devices, prototype research, quality control, environmental research purposes and for small pre-series or series production.

RSO-650 Reflow Solder Oven

Key features are precise controlled fast ramp-up and ramp-down rates which are 75°C/second for ramp-up (115V: 15°C/second) and a ramp down (e.g. T=600°C down to 400°C) with up to 200K/minute. These steps are programmable up to a maximum of 650°C. The furnace is programmed with controller software by using the RS-232 interface connected with a standard PC. This allows the storing of unlimited programs where all temperature profiles with segments can be saved. A further feature is the choice between precisely programming the ramp-rate or the ramp-to-target.

The Reflow Solder System RSS-350 is developed for small budget and space purposes. The system has one separate chamber and an external process controller. It is an excellent tool for various solder processes and other applications. Some applications are: as laboratory hot plate for all kind of developers implementing and researching new processes, e.g. flux less soldering, flip-chip process, adhesive bonding, hermetic sealing under controlled atmospheres, solder bump reflowing, encapsulation of housings, soldering of power devices, heat treatment of semiconductor wafers,  prototype research, quality control, environmental research purposes and for small pre-series or series.   

RSS-350 Reflow Solder Oven

Key features are precise controlled fast ramp-up and ramp-down rates which are better 120°C/minute for ramp-up and a ramp down rate of better 100°C/minute. These steps are programmable from room temperature up to a maximum of 350°C. The process is programmed by an external controller which is provided with software. You can control the process either directly at the controller (there is a display showing the status) or by using the RS-232 interface connected with a standard PC. This allows storing of unlimited programs where all temperature profiles with segments can be saved. An additional feature is the choice between precisely programming the ramp-rate or the ramp-to-target.