Maximum substrate dimension - 155mm x155mm (6in. x 6in.)

Image resolution is fixed - selectable within a range of 5um to 40um per pixel.

Programmable /selective illumination.

Substrates are automatically handled.

Reject-map reports/display for operator information.

Can provide continuous sampling to 100% inspection.

Missing print.

Extra print.

Contamination.

Fibers.

Misalignments in x, y and q of conductor, resist, dielectric and over-glaze relative to fiducials, other print layers, holes and substrate edges.

Unacceptable variations in line widths, pads, or other printed feature dimensions and postage stamp edge effects.

Missing scribe lines.

In automatic mode, the imaging head automatically scans and inspects the substrate.

Defects are recorded by type, severity and location (circuit number / section of circuit).

Images of all identified defects may be presented on the operator display for operator review.

In engineering mode, the inspection operation is performed interactively with the operator.

Alarm condition for consecutive defects and defect population limits.

Production statistics for each batch.

Statistical reporting by defect type for each print layer.

Measurement data including for example (SPC data) -distribution, mean, etc. for selected printed features.

Spatial distribution map of defects on circuit or substrate.

Inspection programs developed off-line on a Stratus 2041 system may be used by the system.

Training of new circuits on the system may be carried out using selected good parts and CAD data input.

The ‘training operator’ confirms inspection tolerances for different circuit features and regions.

Trained circuits are stored in the system’s library database for future call-down.

Inspection program is selected from menu, based on product name/code identifier/print layer number.

Batch information and other specified production information is recorded at start of batch.

Parallel printer port.

Computer networking.