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PureCon™
materials have been engineered as a UHV materials solution for
GMR thin film head production, as well as MRAM
applications. PureCon™ materials have been purified to reduce the
gaseous impurities to extremely low levels. At the same time, further
metallic impurity reductions have also been achieved. These improvements
have been implemented without sacrificing consistently fine grain size.
The net result yields sputtering targets that are optimal not only for
current thin film deposition equipment, but also for use in future
generation UHV deposition tools. |
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