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TARGET BONDING |
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Utilizing a variety of sputtered and
evaporated techniques, Williams Advanced Materials offers target bonding
to backing plates, enabling bonded assemblies to withstand a broad range
of operating temperatures and parameters. |
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GENERAL |
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Through our global manufacturing reach we
are able to offer bonding services in Brewster NY, Santa Clara CA,
Buffalo NY, Ireland, Singapore, and Taiwan.
Williams specializes in indium solder bonding of materials with highly
dissimilar coefficients of thermal expansion. |
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WILLIAMS SUPPORTS A WIDE VARIETY OF OEM PLATFORMS |
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AMAT™, Novellus™, Trikon™, Anelva™,
Ulvac™, SFI™, KDF™, NEXX™,
CVC™, Unaxis™, Veeco™, Singulus etc. |
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RELATED TO THIS ITEM |
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+ Sputtering Target Recycling
+ PVD Chamber Services - PVD Shield Cleaning, Parts Cleaning, Precious
Metal Recovery |
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Specialty bonding materials with highly
dissimilar coefficients of thermal expansion. |
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