 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
EXTRUDED BONDING WIRE & RIBBON |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Bonding wire is
manufactured using our proprietary hydrostatic extrusion process,
providing a cleaner and more uniform wire. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Fewer reductions due to low friction |
 |
Smaller, more uniform ball size on pad |
 |
Reduced bonding tool
problems |
 |
ISO 9002 Certified |
 |
Elimination of imperfections with extreme pressure
that envelops the metal as it passes through the die |
|
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
GOLD PRODUCT SOLUTIONS |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
|
 |
 |
Gold Bonding Wire is available
with a variety of engineered chemistries. Gold wire is produced to
meet the specifications of virtually all industry bonders and
applications. Williams also offers our HBX PLUS™ wire which is a Low
Loop, Long Length wire for today's miniaturized packages.
Gold
Bonding Ribbon is designed for high-power, high-reliability applications
such as microwave devices. Williams' extrusion process is well suited
to achieve the metallurgical consistency and winding requirements of all
bonding ribbon applications. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
HBX PLUS |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
HBX PLUS is ideal for applications that call for long length and low loop bonds.
Williams' alloying expertise and stringent manufacturing process
controls provides the foundation to meet the industries need for
high-speed fine pitch bonding wire. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
ENGINEERED CHEMISTRY & SUPERIOR TECHNOLOGY |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Specifically designed chemistry
for high speed, fine pitch wire bonding
|
 |
Precise control of impurity levels
leads to consistent material properties. |
 |
Be and Ca modified, 4-9's Au wire
for improved break strength and smaller heat affected zones |
 |
Fully automated, multiple pass
drawing technology leads to consistent wire properties, better
wire finishes and improved bonding quality |
 |
Capable of winding up to 2000
meters per spool for improved equipment up time |
|
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
By
controlling the dopant levels, the annealed break strength of the wire
is increased, making HBXPLUS ideal for long length bonds.
|
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
The same dopants also
act to raise the re-crystallization temperature, which minimizes the HAZ,
making HBX PLUS ideal for forming low loops. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
PERFORMANCE ATTRIBUTES |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Ideal for long length, low loop
bonds |
 |
Very resilient, high stiffness
resistant to wire sweep |
 |
Improved bonding tool performance
|
|
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
to
the
Bonding Wire
Spool information
page
|
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
Get
the
Packaging Removal Instructions sheet
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
HBX (for
automatic bonders)
|
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
|
 |
 |
TYPICAL MECHANICAL PROPERTIES FOR GOLD WIRE |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |