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BCB cure

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YIELD Engineering Systems Inc.

YES home page
BCB CURE 

Benzocyclobutene (BCB) is used to create photosensitive polymers, which require fewer processing steps than dry etch materials. BCB-based polymer dielectrics may be spun on or applied to a variety of substrates for use in MicroElectro-Mechanical Systems (MEMS) and microelectronics processing.

APPLICATIONS 

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Adhesive wafer bonding
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Low-K dielectrics
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CMOS
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Bipolar devices
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Optical interconnects
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Intracortical neural implants

BCB’s primary advantage over other polymers is its compatibility with conventional integrated circuit (IC) processing techniques as well as with various metallization systems. BCB also has a low-K dielectric, a low dissipation factor at high frequencies, low moisture absorption, and a high degree of planarization.

A BCB cure oven, such as the YES-1224, is used for the process.
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Last modified: 2009-11-02