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Wire Bond Surface Preparation

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YIELD Engineering Systems Inc.

YES home page
WIRE BOND SURFACE PREPARATION 

YES G1000

After hybrid manufacturers stick the IC chip to the ceramic substrate, it’s baked to cure the epoxy. But this process causes small amounts of contamination on top of the bond pads that can inhibit wire bonding. Therefore, treating the surface to remove contaminants improves the wire bond.

YES plasma cleaning systems such as the YES-G500 & G1000 are ideally suited for wire bond surface preparation.
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Last modified: 2011-11-12