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YES HIGH
TEMPERATURE CURE OVENS |
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MANUAL SYSTEMS |
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YES high temperature
cure ovens are designed to provide a controlled ramp curing process for
temperatures up to 450ºC in an oxygen-free environment. In addition, YES
ovens provide a cleaner process in a controlled environment, so you’ll
get higher yields. Our ovens offer a unique cooling package to reduce
your process time and utilize laminar flow technology, so wafers in our
ovens stay clean.
(Automatic systems - see below) |
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BENEFITS |
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Yield Engineering System’s
YES 450PB Series |
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Critical steps in any cure process include complete removal of residual
solvents, uniform temperature distribution, pressure control, ability to
maintain dry inert atmosphere, and control of heating and cooling rates.
Our systems achieve this plus particle reduction in most applications. |
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APPLICATIONS |
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Low-K
dielectric cure |
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Polyimide bake
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BCB cure |
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Copper anneal |
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Low-K
dielectric cure |
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INFORMATION
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to
Product Specification Chart |
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to YES
Info Page |
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SOFTWARE OPTIONS |
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to
Process
Management Software |
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Yield Engineering
System’s YES 450PB Series product line incorporates input from major
semiconductor process engineers and manufacturers. As a result, these
high temperature vacuum cure ovens offer vertical laminar flow paired
with a unique cooling package.
The vertical laminar flow carries particulates away so they won’t
deposit onto wafers. Directing the airflow so it streams from the top of
the system and out the bottom ensures there’s no air turbulence,
allowing particle reduction in most applications. The YES 450PB Series
cooling package only uses air, no water. The cooling package allows for
faster cooling times as well as temperature uniformity control
throughout the process. The design allows the process engineer total
control of ramp down rates within the tool’s specifications. |
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ADDITIONAL FEATURES |
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Vacuum/Nitrogen purges to remove almost all oxygen before
processing starts. |
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Pre-heated
Nitrogen at the required oven temperature to heat the process
atmosphere surrounding the wafers. |
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Controlled
ramp temperature up from ambient to operational temperature at
up to 20 degrees per minute C. |
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Ability to
achieve faster, uniform solvent evaporation, which reduces
process time and increases product throughput. (Low pressure,
laminar flow creates higher boundary layer diffusion rates and
more uniform bulk gas solvent concentration. Faster solvent
evaporation eliminates dwell steps. required for competing
atmospheric processes). |
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Control of
the ramp down temperature to the selected temperature before
removing product. |
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Oxygen
levels of below 10 ppm during processing. This makes for a
better film, so polyimide bonds aren’t weakened. Controlled
convection cooling to reduce process cooling time and improve
low temperature control stability. |
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Adjustable
air mixing ratio for chamber cooling to adapt the tool for best
performance over a broad range of operating temperatures. |
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Lower
nitrogen usage for vacuum chamber cycle purge process. |
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Process
control management software (option). |
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YES HIGH
TEMPERATURE CURE OVENS |
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AUTOMATIC SYSTEMS
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The YES-PBV300 system
is the latest addition to our line of high temperature vacuum cure
ovens. YES-PBV300 incorporates the unique cooling system and laminar
flow technology of the YES-450PB Series, as well as offers optional
chemical vapor deposition (CVD) and plasma. |
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YES-PBV300 system |
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Combining CVD and/or plasma cleaning reduces steps and keeps your
process clean. Wafers remain in the oven without exposure to atmosphere.
YES-PBV300 is intended for applications that require accurate ramping
temperature control with extremely low oxygen process concentrations,
low particle addition, and/or controlled
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APPLICATIONS
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Surface
preparation |
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Polyimide bake |
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BCB cure |
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Copper anneal |
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Copper oxide
removal |
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INFORMATION
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to
Product Specification Chart |
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to YES
Info Page |
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SOFTWARE OPTIONS |
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to
Process
Management Software |
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FEATURES |
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OPTIONS
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Horizontal
laminar flow for increased particle isolation and removal (for
most cure processes, average particle addition is negative) |
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Front
touchscreen user interface for process control, recipe editing,
process variable display, and maintenance operation |
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Controlled gas
composition |
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Nitrogen
purged dual o-ring door seal to eliminate oxygen leakage into
chamber |
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One process
gas standard, additional available as an option |
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Accelerated
cooling rates with variable speed; forced convection cooling
outside (exterior) of the vacuum chamber |
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Chamber
cooling air mixed with ambient air to reduce cooling air exhaust
temperature |
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Variable
ambient air mixing ratio for maximum cooling performance |
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Chemical vapor
deposition (for silane surface conditioning needed for copper
diffusion barrier deposition, copper oxide removal, copper
oxidation barrier deposition, and porous low-k dielectric plasma
damage repair applications) |
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Plasma
cleaning for surface preparation |
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Second and
third process gasses |
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Mass flow
controllers for all process gasses |
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Continuous
monitoring of process chamber vacuum exhaust oxygen
concentration |
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Downstream
pressure control with CDG pressure measurement and variable vacuum throttle valve
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INTEGRAL
ENVIRONMENTAL FRONT END MODULE |
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Automatic loading of
product wafers into the YES-PBV300 takes place in an Integral
Environmental Front End Module (EFEM). The EFEM can accept either a
300mm FOUP or a 200mm cassette in a FOUP adapter. With the appropriate
optional features, the EFEM can accept automated FOUP loading from an
automated material handling system. |
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