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YES PLASMA
PHOTORESIST STRIP/DESCUM
SYSTEMS |
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In wafer fabrication,
photoresist is used to transfer a circuit pattern onto the wafer. Once a
pattern is transferred, the remaining photoresist must be removed from
the wafer before it can move to the next processing step. The process of
removing residues (scum) is known as descumming.
Plasma systems are effective for stripping thick layers of photoresist,
descumming, etching, and removing organics. Plasma is an ionized gas
capable of conducting electricity and absorbing energy from an
electrical supply. (Lightning and the Aurora Borealis are naturally
occurring examples of plasma). Manmade plasma is generally created in a
low-pressure environment.
When a gas absorbs electrical energy, its temperature increases causing
the ions to vibrate faster. In an inert gas, such as Argon, the excited
ions can bombard a surface ("sandblast") and remove a small amount of
material. In the case of an active gas such as Oxygen, ion bombardment
as well as chemical reactions occur. As a result, organic compounds and
residues volatilize and are removed. |
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YES-CV200 systems
remove thick layers of photoresist in the shortest amount of production
time. Powerful plasma stripping "sandblasts" tough resist in an
automated, user-friendly system. Or, for gentler cleaning operations,
the "descum" function can be selected at the switch of a button.
Touch screen control and real time pictorial readout of system status
and maintenance requirements are standard. Process data is output to a
recording computer and compiled into a Microsoft® Excel report. |
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BENEFITS
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YES
CV200RF Plasma Photoresist Strip/Descum System |
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Automated
process |
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Strip rate up
to 15,000 Angstroms per minute |
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Real time
temperature control |
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Less than 10
mV electron shift, even with sensitive gate oxides |
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Touch screen
interfaced to PLC controller for control of process parameters and
maintenance information |
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External
control and monitoring of process parameters |
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Optional
chamber cooling jacket provides increased temperature control
for greatest repeatability of strip rate wafer to wafer
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FEATURES
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Full PLC Control |
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Touchscreen Operator Interface |
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End point
detection |
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Multiple mass
flow controllers |
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Long diode
lifetime |
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Variable
process temperature and pressure |
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Variable
microwave power (up to 2 kW) |
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Real-time
power auto-tune |
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Sophisticated,
yet user friendly software |
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Auto detects
wafer cassette size |
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Up to 32
engineer defined operating programs can be stored in protected
memory |
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OPTIONS |
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to
Process
Management Software |
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TECHNICAL NOTES |
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Refinements
of Plasma Processing
Technical Note 
TF1
Wafer Testing
Technical Note |
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