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ASM PACIFIC TECHNOLOGY LTD.

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ASM EAGLE339 SERIES HIGH SPEED AUTOMATIC BALL BONDER

The Eagle is designed to meet today's equipment needs for higher speed production of more difficult devices.  The Eagle easily accommodates the demanding and ever-tightening specifications on fine pitch requirements, long wires, low loop height, multi-tier looping, stacked die and more.

EAGLE 339

ASM Model 339 thermosonic wire bonder
339 thermosonic wire bonder

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THERMOSONIC WIRE BONDER

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Gold wire diameter 15 to 76 microns

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35 m ultra fine bond pad pitch capability

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60+ ms ultra high bonding speed for 2 mm wire length

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Up to 33K UPH for chip LED with PR look ahead

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Total yield control

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Advanced loop control

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Enhanced EFO control systems

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Enhanced optics with on-line inspection

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Host communication for factory automation

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Eagle60-01 is for single reel leadframes

 
EAGLE 339XL 

ASM 339XL for "hybrid" applications
339XL for "hybrid" applications

bullet ULTRA HIGH SPEED BONDER FOR HYBRID APPLICATIONS
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One pass solution for large bond area packages e.g. standard ceramic of 4 x 4, chip on board, printed circuit and multi-chip modules.

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Largest bond area of 88 mm Y-bondable distance

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Compact and low inertia digitally controlled bond head with built-in features

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Ultra fast speed up to 8 wires/sec with extreme precision

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Advanced loop algorithm with superior looping
trajectory profile, auto-tuning technology

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Bond process monitoring with post-bond inspection, free air ball formation monitoring and non-stick detection monitoring

 
EAGLE 339-02

ASM EAGLE 339-02 "for display/bent leadframe" applications
339-02 for "display/bent leadframe" applications

bullet AUTOMATIC GOLD WIRE BALL BONDER
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Specially designed for 7 segment display/ bent leadframe applications

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Comprises all standard features of Eagle60

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Conversion of window clamper and top plate for different leadframe packages

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High performance PR with MMX technology

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Unique dual path optics applicable to wider range of packages

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LED controlled lightings

 
EAGLE 339-03

ASM EAGLE 339-03 "for Optoelectronic" applications
339-03 for "optoelectronic" applications

bullet AUTOMATIC GOLD WIRE BALL BONDER FOR OPTOELECTRONIC APPLICATIONS
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Application includes vertical LED, photo transistors and infrared diodes

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PR look ahead

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High UPH of 22K

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Advanced digital controlled bond head
with built-in force sensor:
- Fast and stable precise z-motion
- Stable z-motion
- Low and consistent impact force
- Fast settling time of impact force

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Automatic simultaneous magazine transfer during bonding

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Movable heater block design to ensure precise fixture of LED (cup) during bonding

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Linear motors and high-resolution encoders in work holder to achieve an accuracy of 3 μm @ 3 sigma

 
EAGLE 339CU

ASM EAGLE 339CU "copper wire" ball bonder
339CU "copper wire" ball bonder

bullet AUTOMATIC COPPER WIRE BONDER
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Specially designed copper kit
- Prevents
FAB from oxidation
- Produces good ball roundness
- Consumes less forming gas

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Copper wire diameter 20 to 125 microns

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Fine pitch copper bonding

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Heavy copper bonding up to 5 mil

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Unique programmable feature, Stitch Bond Enhancer, which improves stitch pull strength and resolves NSOL

 
ASM DUAL-HEAD SERIES HIGH SPEED AUTOMATIC BALL BONDER

The "Harrier" and "TwinEagle" are built on the Eagle platform to achieve almost a double production throughput. The bonders are designed to meet today's equipment needs for a even higher speed production of more difficult devices. 

HARRIER 

ASM HARRIER "dual bond head" ball bonder
HARRIER "dual bond head" ball bonder

bullet DUAL BOND HEAD WIRE BONDER
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Ultra high speed (1.9 times of Eagle60)

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50 μm BPP

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Accuracy of 3.5 μm @ 3 sigma

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Dual wire size application

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Dual wire types: Au and Cu

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Discrete and low I/O ICs

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Two independent bonding stage and system

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Support different work holder indexing mode
- Left to right magazine configuration
- In and out from same magazine side

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PR look ahead to maximize the throughput

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Single path optics

 
TWINEAGLE  


TwinEagle "dual bond head" ball bonder

bullet DUAL BOND HEAD WIRE BONDER
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Ultra high speed (1.9 times of Eagle60)
35 m ultra fine bond pad pitch capability

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Accuracy of 3 m @ 3 sigma

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Highest output with smallest footprint

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Independent 2-in-1 bonding system

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Workholder-reverse indexing

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Dual wire sizes

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Dual wire types: Au and Cu

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Support different work holder indexing mode
- Left to right magazine configuration
- In and out from same magazine side
PR look ahead to maximize the throughput

 

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Last modified: 2016-08-22