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ASM AD898 EPOXY DIE BONDER 

The AD 898 Epoxy Die Bonder for 8" wafers continues the path undertaken by ASM to provide customers with the highest quality and best cost / performance systems on the market.  With its capability to handle up to 8" wafers, fully automatic operation, Epoxy Writer, Pre & Post Bond Inspection and Wafer Mapping, the AD 898 is able to provide the customer with exceptional operational results.

AD898

ASM Model AD898 Epoxy Die Bonder
AD898 Epoxy Die Bonder

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AUTOMATIC DIE BONDER

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High accuracy with excellent productivity:
- 320 ms system cycle time
- 25.4 μm @ 3 sigma XY placement
- 0.5 @ 3 sigma die rotation

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Flexible indexing clamp for substrate thickness of 0.1 to 2 mm

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Real time epoxy pattern inspection and alignment

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Automatic pre-bond and post-bond inspection
Die size range: 10 x 10 to 1000 x 1000 mil

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Automatic wafer handling system to handle up to 8" wafer

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Flexible work holder for different applications
Applications include Mini-BGA, Flex BGA,
- CSPBGA, MLP / QFN, QFP, TQFP, PLCC,
- TSSOP, TSOP, SOIC, SOT, PDIP, stacked
- CSP, Image sensor and singulated unit.

 
ASM AD8912/AD8912SD EPOXY DIE BONDER 

The AD 8912 Epoxy Die Bonder for 12" wafers continues the path undertaken by ASM to provide customers with the highest quality and best cost / performance systems on the market.  With its capability to handle up to 12" wafers, fully automatic operation, Epoxy Writer, Pre & Post Bond Inspection and Wafer Mapping, the AD 8912 is able to provide the customer with exceptional operational results.

AD8912/AD8912SD

ASM Model AD8912 Epoxy Die Bonder
AD8912 Epoxy Die Bonder

bullet AUTOMATIC DIE BONDER FOR 12" WAFERS
bullet AD8912SD FOR STACKED DIE APPLICATION
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Robotic wafer handling system for wafers up to 12"

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High accuracy with excellent productivity:
- 320 ms system cycle time
- 25.4 μm @ 3 sigma XY placement
- 0.5 @ 3 sigma die rotation

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Die size range: 10 x 10 to 1000 x 1000 mil
Universal workholder conversion for various packages

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Flexible indexing clamp for leadframe / substrate thickness 0.1 to 2mm

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2 to 4 mil thin die bonding capability
Real time epoxy pattern inspection and position alignment

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Applications include Mini-BGA, Flex BGA,
- CSPBGA, MLP / QFN, QFP, TQFP, PLCC,
- TSSOP, TSOP, SOIC, SOT and PDIP

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AD8912SD for stacked die application

 

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Last modified: 2016-08-22