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ASM PACIFIC TECHNOLOGY LTD.

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AD900/AD900TS HIGH SPEED AUTOMATIC FLIP-CHIP DIE BONDER 

The AD900 Flip-Chip Die Bonder for IC application is a new machine designed for customers running up to 8 inch wafers.  It provides the customer with exceptional volume throughput with good placement accuracy.  The AD900 is a further example of ASM's commitment to the customer for continued improvements in reducing their assembly processing costs.

AD900/AD900TS

ASM Model AD900 Flip-Chip Die Bonder
AD900 Flip-Chip Die Bonder

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FLIP CHIP BONDER

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THERMOSONIC FLIP CHIP BONDER

bullet Precise placement accuracy:
10 m @ 3 sigma
bullet High productivity:
- 0.6 sec/cycle (without up-looking inspection)
- 0.8 sec/cycle (with up-looking  inspection)
bullet Die size range: 10 x 10 - 700 x 700 mil
bullet Bond force with real time
feedback control
bullet High process flexibility:
- Flux dispensing via writer system
- Flux dipping
- Input magazine for stencil print
bullet Convertible flip chip and die bonding process
bullet AD900TS comes with thermosonic flip chip capability
bullet Placement accuracy: 15 μm @ 3 sigma
 
ASM AD8912/AD8912SD EPOXY DIE BONDER 

The AD9012 Flip-Chip Die Bonder for IC application is a new machine designed for customers running up to 12 inch wafers.  It provides the customer with exceptional volume throughput with good placement accuracy.  The AD9012 is a further example of ASM's commitment to the customer for continued improvements in reducing their assembly processing costs.

AD9012

ASM Model AD9012 Flip-Chip Die Bonder
AD9012 Flip-Chip Die Bonder

bullet FLIP CHIP BONDER
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Robotic wafer handling system for wafers up to 12"

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Precise placement accuracy: 10 μm @ 3 sigma

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High productivity:
- 0.6 sec/cycle
  (without up-looking inspection)
- 0.8 sec/cycle
  (with up-looking inspection)

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Die size range: 10 x 10 - 700 x 700 mil
Real-time bond force control with feedback system

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High process flexibility:
- Flux dispensing via writer system
- Flux dipping

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Convertible flip chip and die bonding process

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Applications include flip chip bonding
- on leadframe, BGA, ceramic substrate,
- singulated unit

 
ASM AD819-11A/AD819-11TS HIGH PRECISION FLIP CHIP BONDER 

The AD819-11A High Precision Flip-Chip Die Bonder for IC application is a new machine designed for high precision die placement. The AD819-11A is a further example of ASM's commitment to the customer for continued improvements in reducing their assembly processing costs.

AD819-11A/AD819-11TS

ASM Model AD819-11A High Precision Flip-Chip Die Bonder
AD819-11A High Precision Flip-Chip Die Bonder

bullet HIGH PRECISION FLIP CHIP BONDER
bullet THERMOSONIC FLIP CHIP BONDER
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XY placement: 10 m

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Die rotation: 0.5

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0.7 sec cycle time

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Linear bond head with 3-phase θ axis

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Submount on work holder XY table

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Configurable bonding process: Flux/ epoxy stamping system

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Up-looking optics for precise die alignment

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Applications include precision flip chip die attach e.g. LD on submount and high brightness LED

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AD819-11TS comes with thermosonic flip chip capability:
- Placement accuracy: 1 μm @ 3 sigma

 
ASM AD819-12A HIGH PRECISION FLIP CHIP BONDER 

The AD819-12A High Precision Flip-Chip Die Bonder for IC application is a new machine designed for high precision die placement. The AD819-11A is a further example of ASM's commitment to the customer for continued improvements in reducing their assembly processing costs.

AD819-12A

ASM Model AD819-12A High Precision Flip-Chip Die Bonder
AD819-12A High Precision Flip-Chip Die Bonder

bullet HIGH PRECISION FLIP CHIP BONDER
bullet

XY placement : 10 m

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Die rotation : 1

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Linear bond head with 3-phase θ axis

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Bond force range: 30 - 150 g

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Submount on work holder XY table

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Configurable bonding process: Flux/ epoxy stamping system

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Down-looking optics for precise die alignment

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Precise moving flipping mechanism:
- X resolution: 0.5 μm
- Y resolution: 0.625 μm

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Optional non-flip bonding capability with up-looking inspection

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Applications include precision flip chip or die attach on submount e.g. LD on submount and high brightness LED

 
ASM SR900 FLUX REFLOW OVEN

The SR900 Flux Reflow Oven designed for in-line solder paste reflow, eutectic solder paste reflow, epoxy curing, snap-cure epoxy curing, etc.. The SR900 is a further example of ASM's commitment to the customer for continued improvements in reducing their assembly processing costs.

SR900

ASM Model SR900 Flux Reflow Oven
SR900 Flux Reflow Oven

bullet FLUX REFLOW OVEN
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Maximum reflow temperature: 400 C

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Dynamic temperature profile with 7 heating zones

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Support both IR and convection heating modes

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High temperature resistant stainless steel conveyor belt

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Inert atmosphere for oxidation-free reflow condition and the use of low-activity flux

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In-line capability

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Applications include high lead (>85% Pb) solder paste reflow, eutectic solder paste reflow, epoxy curing, snap-cure epoxy curing, etc.

 

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Last modified: 2016-08-22