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ASM PACIFIC TECHNOLOGY LTD.

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ASM HUMMINGBIRD WAFER STUD BUMPING 

The ASM Hummingbird, the innovative solution to the increasing demand for stud bumpers. A further example of ASM's commitment to the customer for continued improvements in reducing their assembly processing costs.

ASM HUMMINGBIRD

ASM Hummingbird "Stud Bumper"
ASM Hummingbird "Stud Bumper"

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WAFER STUD BUMPER

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Cu/Au bumping capability

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Unique features for Cu bumping

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Unique N2 chambers design

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Retrofit kit at bond head to ensure oxide-free FAB

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Cu FAB formation

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Thermosonic (TS) bonding method

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Short bumping time of 20 bumps per sec or 50 ms per bump

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138 kHz transducer for low temperature process on wafers

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Bumping accuracy at 3.5 m @ 3 sigma

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Large wafer handling - 12 max.

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Complete wafer protection

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Thermal shock prevention by pre-heat and   post-bond stage

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Independently controlled heater with 4 heater rods to ensure stable and consistent temperature distribution

 

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Last modified: 2016-08-22