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ASM PACIFIC TECHNOLOGY LTD.

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ASM AD520A HIGH SPEED AUTOMATIC WEDGE BONDERS

The AB520A is designed for today's needs for fast turn production of COB/PCB & LED Display devices. The AB520 provides the user with a bonding solution capable of handling fine pitch applications with high speed and easy versatility.   Additionally, the AB520A easily meets the needs of a development lab.

MODEL 520A

ASM Model AB520A ultrasonic wedge bonder
AB520A ultrasonic wedge bonder

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AUTOMATIC ULTRASONIC WEDGE BONDER

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Gold wire diameter 15 to 76 microns

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High speed bonding: 6 wires/sec

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Fine pitch capability
- Pad pitch: 80 m
- Pad size: 70 m @1.0 mil Al wire

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Automatic PR alignment

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BQM system for material bondability enhancement

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Automatic wire loss detection

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Programmable bond force

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High stiffness bond head with AC servo control motion

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Extremely high resolution XYθ work holder and bond head

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XY resolution: 0.625 m

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θ resolution : 0.0036

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Fast response voice coil wire clamp with programmable wire clamping force

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Package applications include chip-on-board, multi-die and LED display

 
ASM AD559A HIGH SPEED AUTOMATIC WEDGE BONDERS

The Model AB559A is designed to meet today's needs for high speed production of Hybrid, COB/PCB & LED Display devices. Additionally Model AB559A accommodates the demanding requirements for versatility, fast conversion and fine pitch bonding.

AB559A

ASM Model 559A "rotary bond head" wedge bonder
AB559A "rotary bond head" wedge bonder

bullet ROTARY BOND HEAD WEDGE BONDER
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High throughput: 4.1 wires/sec

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Fine pitch capability:
- Pad pitch: 68 m
- Pad size: 63 x 80 m @1.0 mil Al wire

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Effective bonding area: 8" x 4"

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Individual programmable looping control

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Hybrid bonding capability

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BQM system for material bondability enhancement

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Vision Lead Locator (VLL) to accommodate lead size variation

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Intelligent pattern recognition capability

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Dual color (red-blue) illumination for substrates at different working environments

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Gold wire bonding application (optional)

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60 wire feed angle (optional)

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Packages applications include chip-on-board,  
- multi-die, LED display, chip-on-flex,
- chip-on-glass and ceramic application

 

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Last modified: 2016-08-22