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MANAGER 

MANAGER 
A probe card verification and management system for multiple die probe cards. Manager is a probecard verification and management system that is intended to be used as a production tool for the characterization of multi-die probe cards before and after use and to facilitate rework of probe cards which do not conform to predefined standards. Manager consists of a computer, unique Windows operating software, a precision measurement system, a software based dual vision system and a precision motion control and measurement system. Manager is intended for the measurement and adjustment of probe card planarization, X/Y location and adjustment, probe contact resistance, bussed-probes, gram force Leakage, relays and component measurements..
 
  

The MANAGER Product Datasheet in PDF format.

Windows Interface  

Manager software runs under Windows NT / 2000 / XP. The combination of a mouse, keyboard and the simple icons or pull down menus and an operator can quickly build a reference data file, obtain a pass or fail verification, perform rework on the card, retest, collect SPC data, print reports, or any of the many other functions which are possible with Manager.  

Verify for Test  

Manager is designed to quickly verify that each probe card conforms to your previously determined acceptable standards for your wafer sort line. Each probe card has itís own unique data reference file into which the pass/fail criteria are placed. All of the Manager's capabilities can be brought up to precisely evaluate each probe's position, automatically measuring the planarization of each probe. Electrical parameters including Contact resistance and Leakage are also measured against the reference file. The simple graphics display shows that the probe card assembly passed or failed. If a failure is determined, a full report can be printed to accompany the card for rework. This quick verification validates that a probe card assembly is ready for test or is in need of rework.   

Double Vision 

The Manager's imaging system consists of two separate top and bottom video camera systems. The two image perspectives clearly define visually, actual X & Y locations. The actual visual locations can be compared with the desired coordinate pad locations which are stored in the reference data file. The coordinate data file can then be placed over the display and compared visually with the actual video image. This unique digital overlay approach provides an exceptionally quick X & Y tip location verification. All video images can be captured and printed to a still image printer for documentation.  

Image Control  

Manager provides extensive software control permitting full probe array or a partial array view. The pad overlays which are based on the earlier created coordinate file permit a fast visual analysis of probe alignment thus permitting immediate rework.  

Re-work & Re-test  

Manager is designed to also serve as a rework platform. A flip table is provided to invert the probecard for rework. Precision probe alignment is maintained as the card is moved from upright to inverted position and return. In the rework mode, each probe position is determined for X/Y and Z location and compared against the reference file. The rework screen provide a clear display of probe planarization relative to the reference plane and the allowable planarization tolerance. The X/Y position of the probes can be scanned and the reference locations can be superimposed over the scanned actual locations to facilitate rework. The video image can be captured and printed to provide visual documentation of location. An overhead video image can also be displayed, captured and printed to provide a top view perspective during rework or for documentation.  

Test Electrical Parameters  

In addition to alignment and planarity, Manager can measure contact resistance and compare the results against the stored reference data file. Probe tips can be cleaned or sanded on the Manager to allow for retest of contact resistance. Manager will also measure probe card leakage, overall probe/trace resistance and installed capacitors.  

Options for Enhanced Operation 

Manager has a selection of available options to expand and enhance the capabilities and operation of the probe card verification and management system. See the listing below for some of the available possibilities.    

A Production Tool 

Although Manager has considerable measurement and analytical capability, Manager has been designed from the beginning to serve its primary mission as a probe card verification system. Itís primary purpose is to ensure the integrity of probe card assemblies and verify that they are ready for test. SPC characterization before and after wafer sort will also allow analysis of probe card performance characteristics and facilitate correlation to test yield.  

Computer 

 

Current Windows PC.  

Remote Diagnostic & Support 

Optional external modem package with remote control software is available or remote diagnostics and support via direct assistance from the distributors technical service support facility.    

Measurement Center  

CHANNELS

The measurement center has 1024 channels. (Option to 4096 channels). 

REPEATABILITY

0.02 mils ( 0,5 micron)

Z-STAGE

Travel - 400 mils ( 10 mm) , Optional 1000 mils (25 mm).

STEP RESOLUTION

Programmable

Y-STAGE

Travel - 12 inches (300 mm).

OVERTRAVEL

Programmable

ACCURACY

0.08 mils ( 2 micron )

Vision System 

Upper imaging system for top view of card assembly for real time probe tip adjustment and external video output connection for video documentation printer. Internal imaging scanner to measure X/Y location and to view the  condition of the probe tips. When combined with a X/Y location data file, actual location can be compared with specified location. An external video output connector allows use of a video printer for documentation. 
Internal imaging capture size is 12 X 0.78 inch (300 mm X 20 mm).
Extremely fast system scans 300 mm in less than 10 minutes. 
This fast Image capture allows for a fast full assessment of X & Y tip location in comparison with the displayed pad locations of the reference file. 

Power Requirements   Fixturing 

Computer - 120 VAC 60 Hz or 220 VAC 50 Hz with switch.

Motherboards - can accommodate most existing motherboards or custom interfaces can be designed based upon customer needs.  

Operating Environment 

Measurement Center - auto switching 90 - 265 VAC 50/60 Hz. 

Temperature

20 - 25 degrees centigrade ( 65 - 75 F.)

Internal power filters to ensure precise measurements even with a marginal power source.

Humidity

55 - 70% RH
Contact Resistance  Leakage 

Measurement Range

0-10 ohms, 10 milli-ohm resolution 

Measurement Range

0-300 nano-amps, 1 nano-amp

Accuracy

1% 

Accuracy

resolution

Current Source

5 milli-amps 

Voltage Source

10 Volt 

Measurement Technique

force current, measure voltage drop 

Measurement Technique

source voltage on probe under test, all other probes on ground.

Components (Resistors)    Components (Capacitors) 

Measurement Range

0-10 meg- ohms 

Measurement Range

1-100 nano-farads(nf) / 100-1000 nf / 1-10 micro-farads

Accuracy

1% 

Accuracy

1% 

Current Source

5 milli-amps 

Measurement Technique

time based measurement 

Measurement Technique

force current, measure voltage drop 

Option (Relay)   Option  (Gram Force) 

Relay Drive Outputs:

64 drive outputs (Optional up to 256) - 250 ma capacity per output

Measurement Range

0 - 10 grams, 50 milligram resolution. 
Option (X & Y error Measurement) 

Accuracy

0.1 gram

Allows X & Y error measurement  

Measurement Technique

measure all probes in one movement and calculate average value
Option (Bussed Probes)  Option (Tip Size Measurement)  

Allows measurement of bussed probes. Also permits individual gram force measurement with gram force option.

Allows tip diameter measurement  

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Last modified: 2016-08-22