HOME ] UP ] FEEDBACK ] CONTENTS ] SEARCH ]
DFS-200

[ DFS-200 ] HiDep ] HiEtch ]
SITE LINKS

 

 

BMR TECHNOLOGY CORP.

BMR Technology Corp.

DFS-200 DOWNSTREAM PLASMA ASHER 

BMR DFS-200 DOWNSTREAM PLASMA ASHER

DFS-200, BMR Technology Corporationís plasma asher, is a downstream plasma asher designed for plasma-damage-free photoresist ashing based on proprietary inductively coupled plasma technology.
Its unique capability of tight wafer temperature control makes DFS-200 particularly useful for photoresist ashing of temperature sensitive devices.
DFS-200ís fully automated vacuum cassette wafer loading system provides cost-effective high throughput photoresist ashing for mass production.

FEATURES  

bullet

Proprietary Inductively Coupled Plasma (ICP) Technology

bullet

Low DC & RF plasma potentials

bullet

Downstream plasma with an optional ion grid

bullet

Plasma-damage-free photoresist ashing with high ashing rate

bullet

Electrostatic Chuck for accurate control of wafer temperature

bullet Low temperature process (<100 degr. C) capability for temperature sensitive microelectronics devices
bullet

Vacuum cassette wafer loading system

bullet

Accurate process pressure control

bullet

Easy-to-use control software with a recipe editor

bullet

Ideal for cost-effective mass production

 

HARDWARE SPECIFICATIONS 
bullet

Process chamber made of 6061-T6 Aluminum billet

bullet

Up to 200mm wafer

bullet Patented inductively coupled plasma source (ICP) for efficient generation of oxygen radicals
bullet

Proprietary electrostatic filed shield for true inductive coupling of RF power to plasma to prevent plasma damage due to electrostatic fields

bullet

Optional ion shield to prevent ion-induced plasma damage Dry vacuum pump

bullet

Controllable process pressure ( 200mTorr ~ 5 Torr ) 1.2 KW RF Power Supply @ 13.56MHz with an automatic match network

bullet

Bipolar type electrostatic wafer clamping

bullet

Wafer temperature controllable from room temperature to 200 degr. C

bullet

Two Mass Flow controlled gas lines

bullet Photoresist ashing rate > 7500 Ň/min
bullet

Windows 2000 based graphic user interface (GUI)

bullet

Automatically controlled 25 wafer cassette loading in vacuum

bullet

A dedicated dual-stage rotary vane pump for cassette loading chamber

bullet

SECS I, II/GEM Interface

HOME ] UP ]
Send mail to info@bita.se with questions or comments about this web site.
Copyright © 1998 BITA ELEKTRONIK SVENSKA AB 
Last modified: 2016-08-22