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GLEN TECHNOLOGIES INC.

Glen Home

YES-GLEN R3A PLASMA CLEANER

This system is PLC controlled and, like the G1000 system, offers real-time English readout of system operating parameters together with remedial action in the event of an abort.
This 500 Watt system has two 14 x 14-inch electrode sets which can be quickly configured to provide any of the three plasma modes listed in the "General Overview" section. The system can be operated in a single or dual plasma sequence with two computer selected plasma gas inputs and a connection for a backfill gas (typically nitrogen).
The system has RS 232 as standard; it is CE compliant and S2/S8 certified.

SERVICE AND RELIABILITY

The YES-Glen System is designed with total reliability in mind. In the unlikely event that service is required, both system drawers simply roll out from the main console. Only hard plumbed vacuum fittings must be accessed from the rear of the system.   

FEATURES  


 YES-Glen R3A

bullet 500 W parallel plate plasma cleaner
bullet Active, electron-free and RIE Plasma modes
bullet Two (2), 14x14-in. electrode sets for 392 sq. in. capacity
bullet Plain English readout of process and diagnostics
bullet Total capacity = 390 sq. in. 
bullet Smallest of the series
bullet Pilot run quantities
PLASMA SELECTION 
bullet Electron-free for cleaning sensitive. electronic devices prior to wire bonding
bullet Active for etching and surface modification prior to bonding
bullet RIE for the most aggressive modification of material surfaces

    

NOTE: The G1000 with the new temperature control and loop program can ideally be used as a plasma stripper. It takes about 1 hour of continuous plasma to remove 1 micron of resist.

YES-Glen designs and manufactures a line of PLC controlled plasma cleaning equipment for cleaning and surface modification for many industries including Semiconductor, Medical, Biochip, Optical and more.

YES-Glen product lines form one of the most comprehensive product ranges in the industry. Systems are available for applications ranging from small volume R&D through higher volume production quantities. Sample sizes range from flat panels to the smallest semiconductor devices. Each system offers quick interchange between five basic operating modes:  

MILD ANISOTROPIC MODES ISOTROPIC MODES   
bullet Downstream, or electron free mode is used for cleaning sensitive electronic devices prior to wire bonding. Product is on a floating tray outside the plasma generation volume. The plasma passes through a grounded tray to the product, balancing the charged species to limit surface charge buildup.
bullet Active mode is used for etching and surface modification prior to bonding applications. Product is on a grounded tray inside the plasma generation area
bullet for cleaning sensitive electronic components normally associated with the semiconductor industry. 
bullet Active Ion Trap is the most aggressive plasma for reactive processes. Product is on an active tray outside the plasma generation volume. Ion trap plasmas have high ion concentrations at low energy levels. 
bullet Downstream Ion trap is for aggressive, electron free cleaning. Product is on a grounded tray outside the plasma generation volume.

  The parallel plate design ensures uniformity of plasma in all modes.
  All RF, Vacuum and Gas control functions are safety interlocked and the systems will shut down in a sealed mode in the event of any parameter going outside preset limits.

PLASMA GAS FLOW  RIE PLASMA FLOW   

Plasma Gas Flow

RIE Plasma

Click on picture to enlarge
(Picture from YES- Glen 1000P-LMC Magazine System)

Click on picture to enlarge
(Picture from YES- Glen 1000P-LMC Magazine System)

ACTIVE PLASMA  DOWNSTREAM ELECTRON-FREE PLASMA  

Active Plasma

Downstream Electron-free Plasma

Click on picture to enlarge
(Picture from YES- Glen 1000P-LMC Magazine System)

Click on picture to enlarge
(Picture from YES- Glen 1000P-LMC Magazine System)

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Last modified: 2016-08-22