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GAISER TOOL COMPANY

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GAISER SMALL WIRE WEDGE INFORMATION   

11. FINE PITCH WEDGE BONDING PAGE 2 (2)

GTC Figure 47-40

Figure 40. This drawing shows the double side relief option. This option provides adjacent wire clearance for very closely spaced bond pad applications. The double side relief feature is standard on the fine pitch wedge series.  

GTC Figure 48-41

Figure 41. This photo shows the 45 side chamfer on a maxiguide style wedge. If the entire "W" of the wedge had been reduced, the maxiguide walls would be nonexistent.

(Photo: courtesy of Integrated Reliabilty Services, Inc.)

The double side relief modification may provide the clearance necessary when bonding down inside a

cavity, between some obstruction, package wall or other device.

GTC Figure 48-42

Figure 42. The double side relief (DSR) option allows for clearance of vertical adjacent loops and other obstructions. This modification can be requested by adding to the end of the P/N "DSR (WxH)". Note that this wedge has the 45 side chamfer modification and the DRS option.

(Photo: courtesy of Integrated Reliabilty Services, Inc.)

The finest-pitch applications currently in production are primarily in microwave devices. The wire sizes are typically 0.001in./25m and smaller.

The majority of these applications use gold wire with flat face tools. For aluminum wire diameters less than 0.001in./25m, the concave side flat (CSF) modification is recommended.

GTC Figure 48-43

Figure 43. This drawing shows a wedge with the CSF modification. The concave face helps to center the wire to the middle of the bond foot. The CSF modification helps to keep the side of the wedge from imbedding into the die pad or lead.

Get the FINE PITCH WEDGE BONDING Document (in FINE PITCH WEDGE BONDING format).

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