Company's ongoing endeavor to provide the
microelectronics industry with the finest wire bonding tools has resulted in the
development of cermet tipped wedges.
The following features make cermet tipped
wedges an excellent choice when selecting a tool for use with gold wire or
performance in microwave devices with small gold wire (0.5 mil through
weld attachment and tool life in gold wire bonding applications
excellent transfer of ultrasonic energy at lower power settings
ultrasonic energy coupling
for GaAs and other sensitive materials
The junction line of cermet material and tungsten carbide for a Gaiser cermet
wedge is approximately 1.5 microns. The very thin junction helps reduce the
ultrasonic energy variance between the materials.
The junction of the cermet material and tungsten carbide for a competitor's ceramic tipped
wedge is approximately 17 microns. This larger junction increases the ultrasonic energy
variance between the two materials.
The Gaiser polished wire feed hole provides smoother wire feeding and
reduces the chance of wire scratching.
An unpolished wire feed hold may cause inconsistent wire feeding and/or
scratching of the wire.
the MATERIAL AND TIP CONFIGURATIONDocument (in