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GAISER TOOL COMPANY

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GAISER SINGLE POINT T.A.B. WEDGE INFORMATION   

1. SINGLE POINT T.A.B. INFORMATION - PAGE 1 (2)

Tape automated bonding (TAB) has long been referred to as the oldest new technology in the microelectronics industry. TAB relies on the die being mounted onto a roll of tape where the leads are connected to the die. After this process of connecting the inner lead bonds (ILB) is complete, the reel of tape containing the die is fed to a station that cuts the die and connected leads in preparation for connecting the outer lead bonds (OLB) to the

package. In the past, bonding all the leads at once has been the method of doing the ILB and OLB. This was accomplished with the use of a tool called a thermode. The disadvantage of this method is the problem of maintaining equal force and therefore equal strength on each lead. A method of bonding each lead separately was developed to address this problem. The method is called single point TAB.

GTC Figure 100-1

Figure 1 The initial GTC single point TAB tools were wedges that incorporated a single CG. The wedge design was used because of the bonding machine's ability to reposition the bonding head or work surface so that the wedge would be in-line with the lead. This assured that the CG always stayed perpendicular to the lead.

GTC Figure 100-2

Figure 2. As customers started using the single CG wedge, many customers wanted to use the wedge without having to rotate the package or the bonding head. In these circumstances, it was found when bonding East and West leads that the single CG wedge did not produce good enough bond strengths. In order to improve the coupling on the East and West bonds, the double CG design was developed.

With considerable interest in being able to use a ball bonder to do TAB, Gaiser developed three new series of tools for single point TAB. The first design was similar to the double CG wedge. The tool was available with or without a flat ground on the shank.

Several users have claimed that the ultrasonics transfer more efficiently with a tool oriented so that the grooves make an "X" on the lead instead of a "+".

GTC Figure 100-3

Figure 3. The first capillary style single point TAB tool design was the 1183 series. Having no flat on the shank offered flexibility in how the tool was positioned in the transducer horn. For either the "+" or the "X" pattern, the tool simply had to be rotated. Once the bonding pattern was determined, the optional flat ("SDF" for the "+" and "SDFA" for the "X") could be called out.

More recent designs having considerable success are the protruding radius and the protruding-V tools. These designs, many believe, help grip the lead

better during bonding than the designs incorporating cross grooves.

GTC Figure 100-4

Figure 4. Pictured here is the protruding-V TAB tool. The "+" pattern shown here is called out by the use of SDF option. The protruding TAB tool has a shorter tool life, and therefore, is often ordered with the diamond-tipped option. Also available in WC, and TIC, these tools work very well when made with a cermet tip (BKCER). 

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