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GAISER SINGLE POINT T.A.B. WEDGE INFORMATION   

2. SINGLE POINT T.A.B. INFORMATION - PAGE 2 (2)

GTC Figure 101-5

Figure 5. The protruding-V TAB tool is one of the most popular TAB tool styles. Similar to the protruding radius tools, the protruding-V design is most often called out with the SDFA option giving the lead the bonded appearance of an "X". 

GTC Figure 101-6

Figure 6. This photo is a gang bonded TAB device. The benefit of the single point TAB approach is that each lead is bonded separately. This assures the quality of each lead. The downside is that single point bonding takes considerably longer than gang bonding.

(Photo: courtesy of Integrated Reliability Services, Inc.)

GTC Figure 101-7

Figure 7. One of the biggest difficulties in TAB is the alignment of the device lead or finger over the package lead. Some of the tightest pitches for any interconnect technology is TAB devices. 

(Photo: courtesy KMD-Kyushu Matsushita Electric Co., LTD, bonds made by SB-series bonder).

Several wafer bumping methods have been developed. The most common of these methods utilize the same techniques used in making standard die metallization. Other methods of wafer

bumping involve the process of putting a ball bond down on the die pad, terminating the wire just above the ball and then flattening the ball to become the new raised die "pad".

GTC Figure 101-8

Figure 8. One of the techniques for wafer bumping involves the bonding of ball bumps on the die. Gaiser has developed several tool series for ball bumping. Since the wire is terminated above the ball, there is no need for an outside radius or a face on the capillary to make the lead bond.

GTC Figure 101-9

Figure 9 Pictured here is a device that has had ball bumps placed and tamped in preparation for the ILB. 

(Photo: courtesy Hughes Aircraft Company)

GTC Figure 101-10

Figure 10. The tamping tool is used for tamping wafer balls or to flatten out rough metallization in prebonding. This ball bump has been tamped.

(Photo: courtesy Hughes Aircraft Company)

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