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JFP-DB5

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JFP Microtechnic 

JFP MODEL DB-5

JFP DB-5 ULTRASONIC FLIP-CHIP die Bonder
The Pick & Place DB-5 is designed for accurate placement of delicate devices on substrate. It achieves a high accuracy placement using a high magnification optical device. Flip option allows a perfect alignment of parts and substrate, mixing both video pictures. A robust, and reliable mechanical concept, designed to be external vibration free. Easy to use, flexible, the DB-5 requires only minimum training to operate.

STANDARD FEATURES 

JFP DB-5 U/S Flip-Chip Die Bonder
DB-5 Flip-Chip Die Bonder
(click on picture to enlarge)

bullet High magnification optical device,
bullet Flip Option allows a perfect alignment of part and substrate, mixing both video images,
bullet Horizontal or vertical ultrasonic transducer

Model Design: Table Top
Motorized Table: 2" (10mm), 10 degrees
Die size: Minimum 500x500m,
Maximum 10x10mm
Substrate handled: Up to 100 mm, Parts hold by vacuum or clamp, Substrate, Package
Table resolution:
<2 m
Joystick: 2 speeds, adjustable
Alignment: Manual, with CCTV, Target generator, Dual video
Bond force:
Programmable, Up to 1000 gram
Soft touch down speed
Adjustable
Work-Holder height
Bond Time:
Programmable, up to 99 sec.
Vacuum: Selectable on or off during bond
Ultrasonic generator: 20/40 w
Horizontal Transducer:
60 kHz
Vision : Colour CCD camera, Vertical viewing
Light: Direct and pen light
Display:
Colour monitor; (Option for Flat monitor or Black and White)

OPTIONS  
Power: 110/230 VAC; < 500 watt
bullet Heavy duty bond head, (3 ranges); Programmable, up to 3000 gram
bullet Flip chip; Up-looking camera, Dual vision
bullet Vertical Transducer Head available
bullet Heated Work-Holder
bullet Binocular for inspection
Vacuum: 70%
Forming Gas: N2
Air: 70 psi - 5 bar
Dimensions: 750x700x600mm (30"x28"x24")
Weight: Shipping; 45 kg (100 lb) 
Standards: Complies with UL and CE standards

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Last modified: 2016-08-22