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JFP PP5

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JFP Microtechnic 

JFP MODEL PP5-2

JFP PP5-2 SEMI-AUTOMATIC PICK & PLACE DIE BONDER 
The Pick and Place PP5 is designed for the precise placement of delicate devices on a substrate or package. The PP5 utilizes a robust and reliable mechanical concept, designed to be extremely stable and vibration free. It is extremely user friendly, requiring minimal training to operate. Light pick up head. Vertical color camera, target generator and optical zoom. Moving the table XY by joystick (Table resolution X,Y = 1m).

FEATURES 

JFP PP-5 SEMI-AUTOMATIC PICK AND PLACE
PP5-2 Semi-Automatic Pick & Place
(click on picture to enlarge)

bullet The version PP5-2 EPO including the basic system and a dispenser system. Display epoxy on screen.
bullet The version PP5-2 EUT including the basic system, a temperature controller with heated work holder.
System: Microcontroller
Optical Zoom: 1 to 12x
Vision: Color CCD, TFT monitor

Die size: min 300x300, max 10 x10 mm
Substrate or package: up to 100 x100 mm

Accuracy: up to 25 m
Motorized tables: X 75mm (resolution 1 m), Y 75mm (resolution 1m), Manual Theta, speed by joystick
Parameter: LCD screen
Bond Force: Programmable 15 g up to 500 g
Bond time: Programmable 0 to 999 s

Scrub:
X&Y
Vacuum: Selectable on or off during bond 
OPTIONS  
bullet U.V curing,
bullet Eutectic, digital control of ramp up and down,
bullet Epoxy by dispenser or stamping,
bullet Hot gas,
bullet Heated work-holder with gas control,
bullet Customer work-holder,
bullet Large Table,
Power: 110/230 VAC; < 500 watt
Vacuum: 70%
Dimensions: 750x700x600mm (30"x28"x24")
Standards: Complies with UL and CE standards

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Last modified: 2016-08-22