MICROTECHNIC The company have been acting in the microelectronic
industry for more then 15 years. The key personal have 25 years of experience and
as a result of market demand developed a line of manual machines for
The line of die bonders/scribe unit is unmatched, as a
result of a ridged design and performance. The machines have been
engineered for maximal accuracy and handling of very
DB-5 FLIP CHIP DIE BONDER
DB-1000 FLIP CHIP P&P DIE BONDER
DB-5 The Pick & Place DB-5 Flip-Chip Die Bonder is
engineered for ultrasonic and heavier bonding designed for accurate
placement of delicate devices on substrate. Flip option allows a perfect
alignment of parts and substrate, mixing both video pictures.
The Flip-Chip, Pick & Place DB-1000/ 1100
Die Bonder is designed for precise and accurate placement of delicate devices on
substrate. It achieves a high accuracy placement of very small parts using
an high magnification optical device, when required for very fine
placement of small parts, as laser diodes.
PP5-2 SEMI-AUTO P&P DIE BONDER
S200-6 and S100-3
The Scribe S200-6 and S100-3 are unique machines designed for low to medium
and breaking of delicate die, such as gallium arsenide and
silicon. It is user friendly, very flexible and uses a scribe and break
sequence that keeps the finished die clean and free from damage.
PP5-2 is a Semi-Automatic Pick & Place Die Bonder
designed for the precise placement of delicate devices on a substrate or
package. The PP5-2 utilizes a robust and reliable mechanical concept,
designed to be extremely stable and vibration free.