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JFP S200-6 and S100-3

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JFP Microtechnic 

JFP SCRIBE S200-6 

JFP SCRIBE S200-6
Scribe 200 machine is easy to use for singulating components on 6 wafer. Robust, the Scribe 200 unit is immediately operational, with a minimum training. Vertical targeting is carried out with a video set including a target generator (video crosshair). A LCD screen allows parameters display and selected through programming wheel. Micro-controller board, power supplies and electronic part are located into back side.

TARGET SYSTEM  


SCRIBE 200-6

bullet Optics and magnification compatible with application.
bullet Field = 1mm.
bullet TFT monitor 17'' and CCD colour camera high definition.
bullet Target generator.
bullet Lightings.
SCRIBING HEAD  
bullet Optics and magnification compatible with application.
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Z movement with adjustable angle.

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Adjustable scribing force 10 up to 150g with graduated rule. Constant weight.

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Diamond tool: Adjustable for angle and rotation.

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Tool Offset with cross-hair.

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Accuracy +/- 5

WAFER TABLE  
bullet Optics and magnification compatible with application.
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Wafer chuck till 6".

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Hold by vacuum.

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Frame/Rings adapters.

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Manual rotation 90, or motor (option)

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Rotation alignment by micrometric screw or motor (option)

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Motor on X axis (display: 1, resolution 0.25m).

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Motor on Y axis (display: 1m, resolution 0.25m).

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Motion control with proportional Joystick

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Accuracy on X axis: +/- 5 m

PARAMETERS  
Power: 110/230 VAC; < 300 watt
bullet Optics and magnification compatible with application.
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Step Index.

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Y scribe speed maximum 1- 100 mm/s.

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Scribing length programmable.

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Repeat scribe.

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Scribe number, Multi-index capability.

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Cuts counter.

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Touch down speed

Vacuum: 60%
Air: 70 psi - 5 bar
Dimensions: 450x700x500mm - 18"x28"x20"
Standards: Complies with UL and CE standards
JFP MODEL S100-3 

JFP S100-3 SCRIBER
The Scribe 100 is a unique machine designed for low to medium production scribing and breaking of delicate die, such as gallium arsenide and silicon. It is user friendly, very flexible and uses a scribe and break sequence that keeps the finished die clean and free from damage. During the breaking mode, the Scribe 100 uses top mylar film to hold the die as the linear knife is raised to break along the core line. The film prevents contamination or stress to the die. All parameters are set from the control keyboard panel. The machine is robust, vibration free and requires minimal training to operate.

STANDARD FEATURES 

JFP Scribe S100-3
SCRIBE 100-3
(click on picture to enlarge)

bullet Manual Alignment with high precision table,
bullet Vision on Color Monitor with Target Generator,
bullet Scribe mode for bars and dies,
bullet Easy adjustment for cutting angle,
bullet Clean breaking sequence preventing contamination and damages,

Model Design: Table Top
Wafer size: Up to 3" (75 mm)
Wafer thickness: 100m and up
Die size: Minimum 200m
Wafer  ring: As standard, frame as option
Manual loading: Lockers

Die size: Minimum 500x500m,
Maximum 10x10mm
Table resolution:
1 m
Joystick: 2 speeds + step or Jog mode
Alignment: Programmable area, manual
Scribe force: Dead weight, Stable, Very low force (3g/50g)
Scribe speed: Programmable, 0.1 to 2 mm/s
Scribe length: Programmable up to full length
Break Mode: Operator control
Breaking mode: Using Top Mylar and Bottom cutter
Mylar: Removable to avoid contamination
Vision: Color CCD camera
Digital zoom: For higher accuracy calibration 1 to 4x
Parameters: Scribe count, Work height, Scribe speed, Touch down speed, Repeat scribe
Material: GaAs, Silicon

Power: 110/230 VAC; < 300 watt Vacuum: 70%
Air: 70 psi - 5 bar Dimensions: 450x700x500mm - 18"x28"x20"
Standards: Complies with UL and CE standards

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Last modified: 2016-08-22