SEMI-AUTOMATIC PICK & PLACE DIE BONDER FROM JFP.
has released a a new Semi-Automatic Pick & Place Die Bonder. The system is built on the
platform with an improved motorized table, featuring a resolution of 1µm (X,Y). Bond
force is programmable from 15 g up to 500 g. A range of process options
NOW HAVE A LINE OF ACCESSORIES AND MOTHERBOARD CARDS
November BEIJERT ENGINEERING started to offer a line of accessories and
motherboard cards for PROBE CARD Testing.
MICROTECHNIC The company have been acting in the microelectronic
industry for more then 15 years. The key personal have 25 years of experience and
as a result of market demand developed a line of manual machines for
ENGINEERING Beijert Engineering designs and manufactures a diversified product line
of motherboards, load boards, test interfaces and custom printed circuit
boards. Motherboards used in conjunction with probe card analyzing Manager, Supervisor XL or
others equipment are a critical and necessary component to measure probe
card correlation and performance prior to production wafer testing,
minimizing tester downtime and increasing yields.
SEMI-AUTO p&pDie Bonder
PP5 is a Semi-Automatic Pick & Place Die Bonder
designed for the precise placement of delicate devices on a substrate or
package. The PP5 utilizes a robust and reliable mechanical concept,
designed to be extremely stable and vibration free.
number of ancillary products for probcard testing, storing and analyzing.