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NEWS LETTER 2005/02  

HYBOND PEG BONDER LINE  

PEG Bonders are basically used to bond insulated wire. Common applications include disk drives, etc.. Also PEG bonding technology can be used as a direct replacement for reflow soldering equipment. Other applications include hard disk head stack assemblies, head gimbal assemblies, microwave, sensor circuits, ball coining, flex-on-flex, ribbon tacking, pin-tab bonding, and mesh bonding.

UPDATED WEBPAGES FOR ASM WIREBONDERS 

We have updated our webpages to include the complete line of wirebonders (ball and wedge) as well as epoxy die, wafer bumping and flip-chip bonders.

ABOUT HYBOND INC.   

HYBOND INC.
Manufactures equipment specifically designed for assembly of electronic products. Their current customers include manufacturers of microwave, semiconductor, and hybrid components as well as hard disks, coils and miniaturized transformers.  

ABOUT ASM PACIFIC TECHNOLOGY LTD.   

ASM PACIFIC TECHNOLOGY LTD.
ASM is world’s number one assembly equipment manufacturer for the global microelectronics industry, offering complete factory automation solutions to customers for their assembly and packaging needs.

 HYBOND PEG BONDERS    ASM PACIFIC TECHNOLOGY LTD.

HYBOND Peg Bonder Line

Model 616-Series Peg Bonders,
Model 616-Series performs ultrasonic attachment of insulated or un-insulated wire/ribbon. It also is used for ball coining, ribbon-tacking, pin-tab bonding, and mesh bonding. 

ASM Bonder Line

ASM Pacific Technoloy Ltd.
We can offer a complete line of wirebonders (ball and wedge) as well as epoxy die, wafer bumping and flip-chip bonders.

For more information contact:


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