Gaiser Tool Company has recently obtained patent pending
status for a new, next-generation small wire wedge design for gold and
aluminum wire. This new design should replace the venerable maxiguide in
To understand the features and benefits of the new
design, it is necessary to understand the two types of
small wire wedge designs currently available.
The first and earliest design, the V-Notch, was introduced sometime in the
early 1960’s. The V-notch design incorporates the front radius (FR), bond
length (BL), and back radius (BR) features we are accustomed to today, with
an open notch design through which the wire must travel after it exits the
wire feed hole.
The second design, and current standard-bearer in wedge performance, is the
Maxiguide. This circa 1979 design was a Gaiser Tool Co. innovation,
invented by Dennis Gaiser. The Maxiguide, also called pocket-type, features
a pocket with side-walls that contains and guides the wire after the feed
hole, and centers the wire under the bond foot geometry (the FR, BL, & BR).
The Maxiguide has proven to provide the best wire centering under the bond
foot and placement accuracy on the bonding pad of any small wedge design.
But today we have the new
wedge, download the
MaxiBond brochure for complete information:
Scribe 200 machine is easy to use for singulating components on 6’’ wafer.
Robust, the Scribe 200 unit is immediately operational, with a minimum
training. Vertical targeting is carried out with a video set including a
target generator (video crosshair). A LCD screen allows parameters display
and selected through programming wheel. Micro-controller board, power
supplies and electronic part are located into back side.
GAISER TOOL COMPANY
As a leading manufacturer of bonding tools since 1967,
Gaiser Tool Company has significantly contributed to the
technology required for the growth of the semiconductor
industry. In 1970, Gaiser Tool Company revolutionized the
wire bonding process by inventing the first alumina ceramic
capillary. In 1997, Gaiser Tool Company developed a superior
and proprietary new process for manufacturing capillaries
for ultra fine pitch bonding, Process1800. This new process
enables Gaiser Tool Company to produce bottleneck style
capillaries that are up to two times stronger than the
bottleneck capillaries produced by our competitors. This
product leads the way in meeting the fine pitch needs of the
Gaiser Tool Company’s long-term commitment to their
customers will always include both the quality of their
products and the quality of their service.