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NEWS LETTER MARCH 2006  

XYZTEC CONDOR MULTIFUNCTIONAL BOND TESTER 
XYZTEC B.V. has developed the most advanced multifunctional pull and shear bond tester available in the market. With the choice of a single or revolving measurement unit head, you will have an advanced system meeting basically all your quality requirements for wire, stud and/or die bonding. 

XYZTEC the "Total Ball Shear Test" (click on picture to enlarge)

THE TOTAL BALL SHEAR TEST

It shears a complete BGA array in one time to verify the breaking surface of the ball on substrate. It is important to know that on BGA a lot of end-users are asking for this new test. XYZTEC has designed a special Condor 100-3 in cooperation with ST Microelectronics. The Y (shear) axis has extra high shear speed till 20 mm/sec., with a special customized Y motor. XYZTEC has so far installed 6 systems to ST Microelectronics plants worldwide.
Until now no one can do this test except XYZTEC. Basically, all the BGA producers are looking for a tester which can do total ball shear. XYZTEC can do this test and already have experience. Feel free to contact us for detailed questions.

(click on image)

Get the XYZTEC "The Total Ball Shear" specification sheet in XYZTEC "The Total Ball Shear" specification format.

For more information contact:

 

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Last modified: 2016-08-22