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EXHIBITION OVERVIEW 

The Productronica 2015 will take place in Munich, November 10- 13, 2015. Preliminary, the following of our suppliers will be present with machines, equipment etc.. 
NOTE: Ulf Berghman will be at the exhibition from Tuesday morning until Thursday afternoon. You can contact him at: 0046 70 594 4230 and (by his German phone number:
+49 1578 588 7385),

 PRODUCT  BOOTH AND CONTACT
to ADT Products Pages

ADT
is a world leader in the development and manufacture of dicing saws and laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation.

Hall B3
  Booth 444

Contact: Yossi Gershon (for Dicing Systems) and Ms. Miri Benita will help you with Dicing Blade questions.

ADT will this year not exhibiting any equipments or systems.

 PRODUCT    BOOTH AND CONTACT  
AERO – Bonder a New Dimension of Wire Bonding

ASM
ASM Assembly Products will show their new Model AERO – Bonder a New Dimension of Wire Bonding. ASM is today the industry leader in Automatic Bonding and assembling equipment and systems.

Hall A3
  Booth 377

Contact: Patrick Van Asch
Key features: "X-Power" New Bonding Technology, Faster XY Table Movement, 22 micrometer Bonded Ball Size, Real Time Yield Assurance Control, Predictive Maintenance.

 PRODUCT  BOOTH AND CONTACT
to AUREL Automation Products Page

AUREL
A
UREL Automation is specialized machines for material deposition and creation of precision-patterns. Screen stencil printers, laser trimming, handling for printed circuit board. Dryers and ovens furnaces for automatic production lines.

Hall A2
  Booth 481

Contact: Nerio Samori
Screen printers , stand alone, in-line, for thick film, LTCC, green energies, sensors. Lasers for trimming, marking, cutting. Work Cell for ink-jet of nano materials, microdispensing, DOD, inspections.

 PRODUCT  BOOTH AND CONTACT
to JFP Products Pages

JFP Microtechnic
Very new is the Model PP400 semiautomatic and PP400M manual Die Bonder, (however not shown at the exhibition, but could be discussed at the booth).

Hall B3
  Booth 341

Contact: François Palomares and Didier Magne,
JFP will show their Model PP5-6 Flip-Chip die bonder and PP-One, manual die placement.

 PRODUCT    BOOTH AND CONTACT  
to Dr. Storage/ ACE Dragon Corp.

Dr. Storage/ ACE Dragon
Model
T60M-480, X2B-600 and F1-1200-6 dry cabinets as well as GT02 data logger, HT-5B hygrometer and SensorLook monitoring system.

Hall A3
  Booth 160

Contact: Ms. Lucy Yu and Reno Tsao
Dry Storage cabinets, Baking Cabinets and Nitrogen Storage solutions as well as Monitoring systems.

 PRODUCT  BOOTH AND CONTACT
to UniTemp Products Page

UniTemp
Thermal Process ovens for laboratory and pre-production requirement. Hotplates/ workstages (workholders).

Hall B3
  Booth 341

Contact: Dr. Christopher Curran and Astrid Birkner
UniTemp will exhibit their new Model RSS-110-S/ RSS-160-S as well as the Model RSS-210-S Reflow Soldering Systems. A brand new Wire Bonder Model WB-200, Hot Plates (workstages/ workholders).

For more information contact:


 

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Last modified: 2016-08-22