
| |
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HYBRIDE GROUP |
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DESCRIPTION |
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ACCUPROBE
Probes,
Probe Cards,
Equipment and
TechInfo |
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 |
High performance probing and interface products for use in the
testing of integrated and hybrid circuit. |
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ADT
7100 Series Dicing System,
7200 Automatic Dicing System,
8000 Next Step Laser Scribing System,
Dicing Blades & Accessories,
Periphial Equipment, |
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 |
 |
ADT is a
world
leader in the development and manufacture of dicing saws and laser scribing
systems, dicing blades and processes used in the dicing of silicon-based
ICs, hard material Microelectronic Components (MECs) and in
package singulation. |
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AEROFEED
Vari-Cab, WPS, and NRC-300/RSC-100 |
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 |
Nitrogen Storage Cabinets, for chip devices, waffle packs, bonding
wire, bonding tools and SMT components. |
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ASM
PACIFIC TECHNOLOGY
Wafer Bump, Die Bonders,
Ball Bonders, Wedge
Bonders
Flip-Chip
Bonder, |
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 |
 |
ASM
is today the world’s number one assembly equipment manufacturer. We have
focused on the their line of Wafer Bump, Die-, Flip-Chip, Wire Ball/Wedge Bonders. |
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AUER
Products, Service |
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 |
Film Frames, Flat Carriers, Magazines, Cassettes and Process
Carriers. |
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AUREL
In-line,
Automatic |
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 |
AUREL Automation is
specialized in manufacturing of automation systems for electronics industry:
Screen
stencil printers, laser trimming, handling for printed circuit board. Dryers
and ovens furnaces. |
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 |
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 |
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 |
BEIJERT
ENGINEERING
Supervisor, Manager
Technician, Pathfinder |
 |
 |
 |
Probe card verification and management system for the production
environment. |
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DR. STORAGE
Products,
How to select/order, |
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 |
Dry Storage cabinets, Baking Cabinets and Nitrogen Storage
solutions as well as Monitoring systems. |
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 |
 |
 |
 |
GAISER
Products,
Information |
 |
 |
 |
Capillaries, Small Wire Wedges, Large Wire Wedges, Single Point
T.A.B. Tools, Gap Welding Electrodes, Die Collets & Vacuum Pick-up Tools and Solder
Reflow Tools. |
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 |
GLEN TECHNOLOGIES
News, Products |
 |
 |
 |
Plasma Cleaning Systems for
Hybrid Circuits, Semi-conductor Wafers, Flat Panel Plasma Displays as well as in-line
equipment for automatic production applications. |
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HYBOND
Ball Bonders, Wedge Bonders,
Peg Bonders |
 |
 |
 |
Manual and semi-automatic PEG/TAB/BEAM-LEAD, Ball, Wedge and
Ribbon Bonding Machines. |
 |
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 |
 |
 |
 |
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 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
JFP
MICROTECHNIC
Products |
 |
 |
 |
Manual
Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and
Break System for sensitive devices. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell |
 |
 |
 |
Near Infrared Furnace Systems for the Hybrid/Thick Film
Applications, Wafer Bump and MCM/Flat Panel Production. |
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STRATUS
VISION |
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Various Inspection Systems for the Thick-Film Hybrid Production. |
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TPT
TECHNICAL PRODUCT TRADE
HB02-05 Series Manual Bonder
HB08-10 Series Semi-Automatic Bonder
HB12-16 Series Semi-Automatic Bonder |
 |
 |
 |
The
HB-Series of bench top size wire bonders are easy to operate and ideal
for laboratories, pilot and pre-production. One Bond head for wire and
ribbon bonding in Wedge or Ball bonding mode. |
 |
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 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
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 |
 |
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 |
UNITEMP
Sealer,
RTP-100, RTP-150,
VPO,
RSO-200, RSS-3X210,
RSS-110-160-310
VSS, Hot Chuck,
Hot Plate and
Accessories |
 |
 |
 |
Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and
pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler
with microcontroller for Bonders. Tool Heater and temperature
controllers. |
 |
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 |
 |
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 |
UTHE
Generators, Transducers,
Negative EFO and Bond Monitor |
 |
 |
 |
Ultrasonic power supplies and transducers, bond monitoring
systems, and other bonding equipment peripherals used in semiconductor assembly and
testing |
 |
 |
 |
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 |
 |
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 |
 |
 |
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 |
 |
 |
 |
 |
 |
 |
 |
MATERION/WILLIAMS
ADVANCED MATERIALS
Vapor Deposition, Lids,
Bonding
Wire, Packaging Materials, Solder
Alloys and Contact Alloys |
 |
 |
 |
Vapor Deposition Products,
Bonding Wire and Ribbon, Hermetic Lids, Solder and Electrical
Contact Alloys |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
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 |
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XYZTEC |
 |
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 |
Multifunctional Bond Testers; for
Wire Pull, Ball Shear,
Wedge Shear, Solder Ball Shear and Die Shear. |
 |
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HYBRID
LINKS
IMAPS, IMAPS Nordic |
 |
 |
 |
Links to Hybrid web sites. |
 |
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 |
 |
SEMI GROUP |
 |
 |
 |
DESCRIPTION |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
ACCUPROBE
Probes,
Probe Cards,
Equipment and
TechInfo |
 |
 |
 |
High performance probing and interface products for use in the
testing of integrated and hybrid circuit. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
ADT
7100 Series Dicing System,
7200 Automatic Dicing System,
8000 Next Step Laser Scribing System,
Dicing Blades & Accessories,
Periphial Equipment, |
 |
 |
 |
ADT is a
world
leader in the development and manufacture of dicing saws and laser scribing
systems, dicing blades and processes used in the dicing of silicon-based
ICs, hard material Microelectronic Components (MECs) and in
package singulation. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
AEROFEED
Vari-Cab, WPS, and NRC-300/RSC-100 |
 |
 |
 |
Nitrogen Storage Cabinets, for chip devices, waffle packs, bonding
wire, bonding tools and SMT components. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
ASM
PACIFIC TECHNOLOGY
Wafer Bump, Die Bonders,
Ball Bonders, Wedge
Bonders
Flip-Chip
Bonder, |
 |
 |
 |
ASM
is today the world’s number one assembly equipment manufacturer. We have
focused on the their line of Wafer Bump, Die-, Flip-Chip, Wire Ball/Wedge Bonders. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
AUER
Products, Service |
 |
 |
 |
Film Frames, Flat Carriers, Magazines, Cassettes and Process
Carriers. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
AUREL
In-line,
Automatic |
 |
 |
 |
AUREL Automation is
specialized in manufacturing of automation systems for electronics industry:
Screen
stencil printers, laser trimming, handling for printed circuit board. Dryers
and ovens furnaces. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
BEIJERT
ENGINEERING
Supervisor, Manager
Technician, Pathfinder |
 |
 |
 |
Probe card verification and management system for the production
environment. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
BMR
TECHNOLGY CORP.
DFS-200 Downstream
Plasma Asher, HiDep
Plasma-Enchance CVD,
HiEtch Inductive Coupled Plasma
ICP, |
 |
 |
 |
One of
the industrial leader in the development of plasma-assisted equipment for
thin film device fabrication.
BMR's advanced plasma technology provides the advanced solutions required
for today's tough thin film materials in various industries. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
DR. STORAGE
Products,
How to select/order, |
 |
 |
 |
Dry Storage cabinets, Baking Cabinets and Nitrogen Storage
solutions as well as Monitoring systems. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
CORFIN |
 |
 |
 |
Tinning
In-Line and Robotic Lead Finish Systems. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
GAISER
Products,
Information |
 |
 |
 |
Capillaries, Small Wire Wedges, Large Wire Wedges, Single Point
T.A.B. Tools, Gap Welding Electrodes, Die Collets & Vacuum Pick-up Tools and Solder
Reflow Tools. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
GLEN TECHNOLOGIES
News, Products |
 |
 |
 |
Plasma Cleaning Systems for
Hybrid Circuits, Semi-conductor Wafers, Flat Panel Plasma Displays as well as in-line
equipment for automatic production applications. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
HYBOND
Ball Bonders, Wedge Bonders,
Peg Bonders |
 |
 |
 |
Manual and semi-automatic PEG/TAB/BEAM-LEAD, Ball, Wedge and
Ribbon Bonding Machines. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
JFP
MICROTECHNIC
Products |
 |
 |
 |
Manual
Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and
Break System for sensitive devices. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell |
 |
 |
 |
Near Infrared Furnace Systems for the Semiconductor
Applications, Wafer Bump and MCM/Flat Panel Production. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
TPT
TECHNICAL PRODUCT TRADE
HB02-05 Series Manual Bonder
HB08-10 Series Semi-Automatic Bonder
HB12-16 Series Semi-Automatic Bonder |
 |
 |
 |
The
HB-Series of bench top size wire bonders are easy to operate and ideal
for laboratories, pilot and pre-production. One Bond head for wire and
ribbon bonding in Wedge or Ball bonding mode. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
UNITEMP
Sealer,
RTP-100, RTP-150,
VPO,
RSO-200, RSS-3X210,
RSS-110-160-310
VSS, Hot Chuck,
Hot Plate and
Accessories |
 |
 |
 |
Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and
pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler
with microcontroller for Bonders. Tool Heater and temperature
controllers. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
MATERION/WILLIAMS
ADVANCED MATERIALS
Vapor Deposition, Lids,
Bonding
Wire, Packaging Materials, Solder
Alloys and Contact Alloys |
 |
 |
 |
Vapor Deposition Products,
Bonding Wire and Ribbon, Hermetic Lids, Solder and Electrical
Contact Alloys |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
XYZTEC |
 |
 |
 |
Multifunctional Bond Testers; for
Wire Pull, Ball Shear,
Wedge Shear, Solder Ball Shear and Die Shear. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
YES
Products,
Info |
 |
 |
 |
Polyimide Bake Ovens, Downstream Plasma Stripper, Vacuum Bake Vapor
Prime Systems, Vacuum Dryers and Stainless Steel Cassettes for Wafer Processing |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
SEMI
Links
SEMI, Semitech, IMAPS |
 |
 |
 |
Links to SEMI web sites. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
SMT/PCB/PWB GROUP |
 |
 |
 |
DESCRIPTION |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
AEROFEED
NRC-300/RSC-100 and
MTS-60 |
 |
 |
 |
Storage Cabinets, for SMT components
like reels, tubes
and magazines of surface mount devices in an ambient environment. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
AUREL
In-line,
Automatic |
 |
 |
 |
AUREL Automation is
specialized in manufacturing of automation systems for electronics industry:
Screen
stencil printers, laser trimming, handling for printed circuit board. Dryers
and ovens furnaces. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
BEIJERT
ENGINEERING
Supervisor, Manager
Technician, Pathfinder |
 |
 |
 |
Probe card verification and management system for the production
environment. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
DR. STORAGE
Products,
How to select/order, |
 |
 |
 |
Dry Storage cabinets, Baking Cabinets and Nitrogen Storage
solutions as well as Monitoring systems. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
FASTECHNOLOGIES
Machine Monitoring,
SmartParts,
DNC UltraServer,
BTR,
FA/PLOT,
CassetteMaster,
NC-CAM Drill,
NC-CAM Rout
and
Information |
 |
 |
 |
CAM Systems for CNC optimization. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
EMC GLOBAL
TECHNOLOGIES
Screen Cleaners, Solder
Pallets
Process Carriers,
Workboard Holders |
 |
 |
 |
Stencil/Screen Cleaning Machines, Workboard Holders, Solder
Pallets and Process Carriers. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
JFP
MICROTECHNIC
Products |
 |
 |
 |
Manual
Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and
Break System for sensitive devices. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell |
 |
 |
 |
Near Infrared Furnace Systems, for the
SMT/SMD Applications. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
UNITEMP
Sealer,
RTP-100, RTP-150,
VPO,
RSO-200, RSS-3X210,
RSS-110-160-310
VSS, Hot Chuck,
Hot Plate and
Accessories |
 |
 |
 |
Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and
pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler
with microcontroller for Bonders. Tool Heater and temperature
controllers. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
MATERION/ WILLIAMS
ADVANCED MATERIALS
Packaging Materials, Solder
Alloys and Contact Alloys |
 |
 |
 |
Performance Packaging
Materials, Solder and Electrical Contact Alloys. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
SMT/PCB/PWB
Links
Nepcon,
IPC |
 |
 |
 |
Links to SMT/PCB/PWB web sites. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
ENERGY GROUP |
 |
 |
 |
DESCRIPTION |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
AEROFEED
Vari-Cab, WPS, and NRC-300/RSC-100 |
 |
 |
 |
Nitrogen
Storage Cabinets, for chip devices, waffle packs, solar cells, bonding
tools and SMT components. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
AUREL
In-line,
Automatic |
 |
 |
 |
AUREL Automation is
specialized in manufacturing of automation systems for electronics industry:
Screen
stencil printers, laser trimming, handling for printed circuit board. Dryers
and ovens furnaces. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
BEIJERT
ENGINEERING
Supervisor, Manager
Technician, Pathfinder |
 |
 |
 |
Probe card verification and management system for the production
environment. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
DR. STORAGE
Products,
How to select/order, |
 |
 |
 |
Dry Storage cabinets, Baking Cabinets and Nitrogen Storage
solutions as well as Monitoring systems. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
EMC GLOBAL
TECHNOLOGIES
Screen Cleaners, Solder
Pallets
Process Carriers,
Workboard Holders |
 |
 |
 |
Stencil/Screen Cleaning Machines, Workboard Holders, Solder
Pallets and Process Carriers. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
JFP
MICROTECHNIC
Products |
 |
 |
 |
Manual
Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and
Break System for sensitive devices. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
RTC
Semiconductor
Flat-Panel/Encapsulation/Curing
Microelectronics, PV/Solar-Cell |
 |
 |
 |
Near Infrared Furnace Systems, for the
Photovoltaic Applications. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
UNITEMP
Sealer,
RTP-100, RTP-150,
VPO,
RSO-200, RSS-3X210,
RSS-110-160-310
VSS, Hot Chuck,
Hot Plate and
Accessories |
 |
 |
 |
Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and
pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler
with microcontroller for Bonders. Tool Heater and temperature
controllers. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
MATERION/WILLIAMS
ADVANCED MATERIALS
Packaging Materials, Solder
Alloys and Contact Alloys |
 |
 |
 |
Performance Packaging
Materials, Solder and Electrical Contact Alloys. |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
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ENERGY
Links
EFN,
EU PV,
Photon |
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Links to Photovoltaic web sites. |
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