DESCRIPTION 

High performance probing and interface products for use in the testing of integrated and hybrid circuit.

ADT is a  world leader in the development and manufacture of dicing saws and laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation.

Nitrogen Storage Cabinets, for chip devices, waffle packs, bonding wire, bonding tools and SMT components.

ASM is today the world’s number one assembly equipment manufacturer. We have focused on the their line of Wafer Bump, Die-, Flip-Chip, Wire Ball/Wedge Bonders.

Film Frames, Flat Carriers, Magazines, Cassettes and Process Carriers.

AUREL Automation is specialized in manufacturing of automation systems for electronics industry: Screen stencil printers, laser trimming, handling for printed circuit board. Dryers and ovens furnaces.

Probe card verification and management system for the production environment.

Dry Storage cabinets, Baking Cabinets and Nitrogen Storage solutions as well as Monitoring systems.

Capillaries, Small Wire Wedges, Large Wire Wedges, Single Point T.A.B. Tools, Gap Welding Electrodes, Die Collets & Vacuum Pick-up Tools and Solder Reflow Tools.

Plasma Cleaning Systems for Hybrid Circuits, Semi-conductor Wafers, Flat Panel Plasma Displays as well as in-line equipment for automatic production applications.

Manual and semi-automatic PEG/TAB/BEAM-LEAD, Ball, Wedge and Ribbon Bonding Machines.

Manual Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and Break System for sensitive devices.

Near Infrared Furnace Systems for the Hybrid/Thick Film Applications, Wafer Bump and MCM/Flat Panel Production.

Various Inspection Systems for the Thick-Film Hybrid Production.

The HB-Series of bench top size wire bonders are easy to operate and ideal for laboratories, pilot and pre-production. One Bond head for wire and ribbon bonding in Wedge or Ball bonding mode. 

Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler with microcontroller for Bonders.  Tool Heater and temperature controllers.

Ultrasonic power supplies and transducers, bond monitoring systems, and other bonding equipment peripherals used in semiconductor assembly and testing

Vapor Deposition Products, Bonding Wire and Ribbon,  Hermetic Lids, Solder and Electrical Contact Alloys

Multifunctional Bond Testers; for Wire Pull, Ball Shear, Wedge Shear, Solder Ball Shear and Die Shear.

Links to Hybrid web sites.

DESCRIPTION 

High performance probing and interface products for use in the testing of integrated and hybrid circuit.

ADT is a  world leader in the development and manufacture of dicing saws and laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation.

Nitrogen Storage Cabinets, for chip devices, waffle packs, bonding wire, bonding tools and SMT components.

ASM is today the world’s number one assembly equipment manufacturer. We have focused on the their line of Wafer Bump, Die-, Flip-Chip, Wire Ball/Wedge Bonders.

Film Frames, Flat Carriers, Magazines, Cassettes and Process Carriers.

AUREL Automation is specialized in manufacturing of automation systems for electronics industry: Screen stencil printers, laser trimming, handling for printed circuit board. Dryers and ovens furnaces.

Probe card verification and management system for the production environment.

One of the industrial leader in the development of plasma-assisted equipment for thin film device fabrication.
BMR's advanced plasma technology provides the advanced solutions required for today's tough thin film materials in various industries.

Dry Storage cabinets, Baking Cabinets and Nitrogen Storage solutions as well as Monitoring systems.

Tinning In-Line and Robotic Lead Finish Systems.

Capillaries, Small Wire Wedges, Large Wire Wedges, Single Point T.A.B. Tools, Gap Welding Electrodes, Die Collets & Vacuum Pick-up Tools and Solder Reflow Tools.

Plasma Cleaning Systems for Hybrid Circuits, Semi-conductor Wafers, Flat Panel Plasma Displays as well as in-line equipment for automatic production applications.

Manual and semi-automatic PEG/TAB/BEAM-LEAD, Ball, Wedge and Ribbon Bonding Machines.

Manual Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and Break System for sensitive devices.

Near Infrared Furnace Systems for the Semiconductor Applications, Wafer Bump and MCM/Flat Panel Production.

The HB-Series of bench top size wire bonders are easy to operate and ideal for laboratories, pilot and pre-production. One Bond head for wire and ribbon bonding in Wedge or Ball bonding mode. 

Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler with microcontroller for Bonders.  Tool Heater and temperature controllers.

Vapor Deposition Products, Bonding Wire and Ribbon,  Hermetic Lids, Solder and Electrical Contact Alloys

Multifunctional Bond Testers; for Wire Pull, Ball Shear, Wedge Shear, Solder Ball Shear and Die Shear.

Polyimide Bake Ovens, Downstream Plasma Stripper, Vacuum Bake Vapor Prime Systems, Vacuum Dryers and Stainless Steel Cassettes for Wafer Processing

Links to SEMI web sites.

DESCRIPTION 

Storage Cabinets, for SMT components like reels, tubes and magazines of surface mount devices in an ambient environment.

AUREL Automation is specialized in manufacturing of automation systems for electronics industry: Screen stencil printers, laser trimming, handling for printed circuit board. Dryers and ovens furnaces.

Probe card verification and management system for the production environment.

Dry Storage cabinets, Baking Cabinets and Nitrogen Storage solutions as well as Monitoring systems.

CAM Systems for CNC optimization.

Stencil/Screen Cleaning Machines, Workboard Holders, Solder Pallets and Process Carriers.

Manual Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and Break System for sensitive devices.

Near Infrared Furnace Systems, for the SMT/SMD Applications.

Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler with microcontroller for Bonders.  Tool Heater and temperature controllers.

Performance Packaging Materials, Solder and Electrical Contact Alloys.

Links to SMT/PCB/PWB web sites.

DESCRIPTION 

Nitrogen Storage Cabinets, for chip devices, waffle packs, solar cells, bonding tools and SMT components.

AUREL Automation is specialized in manufacturing of automation systems for electronics industry: Screen stencil printers, laser trimming, handling for printed circuit board. Dryers and ovens furnaces.

Probe card verification and management system for the production environment.

Dry Storage cabinets, Baking Cabinets and Nitrogen Storage solutions as well as Monitoring systems.

Stencil/Screen Cleaning Machines, Workboard Holders, Solder Pallets and Process Carriers.

Manual Pick & Place Ultrasonic/ Eutectic Flip Chip Die Bonders. Manual Scribe and Break System for sensitive devices.

Near Infrared Furnace Systems, for the Photovoltaic Applications.

Vacuum Sealer for MEMS, Rapid Thermal/ Vacuum Process/ Solder Reflow ovens for laboratory and pre-production requirement. Chucks/ Hotplates/ Workstages (workholders). A smart wire spooler with microcontroller for Bonders.  Tool Heater and temperature controllers.

Performance Packaging Materials, Solder and Electrical Contact Alloys.

Links to Photovoltaic web sites.

DESCRIPTION 

Accuprobe Inc.: Probe Card Assembly Service.

Auer Precision: manufactures precision stampings for the commercial, industrial, aerospace, government, computer and semiconductor industries.

Corfin Inc.: Robotic tinning with trim and form, is available on a contract basis.