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RADIANT TECHNOLOGY CORP.

RTC Home

ABOUT RTC 

RADIANT TECHNOLOGY CORPORATION
Welcome to the World of Radiant Technology Corporation. RTCs goal is to provide its customers and partners, with the highest quality of conveyorized thermal processing equipment anywhere. To this end, RTC has designed numerous features into our equipment, many of them patented, to help assure our client's success in achieving their goals.
RTC equipment is highly responsive to critical temperature settings. With infrared lamps as the primary heat source, the equipment is literally heating with the speed of light. RTC's unique and patented gas management system provides an extremely even distribution and well regulated flow of gas throughout the process chambers. 
RTC has introduced many "firsts" involving the application of near infrared heating. Among them are:         

bullet FIRST HIGH TEMPERATURE FURNACE capable of operating at 1000C with extremely tight temperature control 
bullet FIRST THICK FILM FURNACE
bullet FIRST CONTROLLED ATMOSPHERE FURNACE capable of <5 PPM Oxygen
bullet FIRST HYDROGEN FURNACE
PRODUCT OVERVIEW 
SIGNIFICANT APPLICATIONS FOR INFRARED FURNACES INCLUDE:

PHOTOVOLTAIC/SOLAR CELL MANUFACTURERS

who require oven process temperatures of 950 degrees C for 24 hours a day, seven days a week operations, at belt speeds up to 120 inches per minute.

FLAT PANEL DISPLAY MANUFACTURERS

who insist on excellent temperature uniformity across belt widths up to 58 inches wide and also demand very low particulates inside the furnace. 

SEMICONDUCTOR PACKAGING

market that requires specialty atmospheres such as hydrogen, forming gas or nitrogen with extremely low oxygen content. 

THICK FILM HYBRID CIRCUIT MANUFACTURERS

who require rapid firing processes without sacrifice in product stability, solder-ability and bond-ability. Infrared furnaces have the flexibility to produce almost any profiles that are impossible to achieve with other furnace technology. 
SEMICONDUCTOR   MCM/FPD/ENCAPSULANT/CURING 
RTC Semiconductor Furnaces and Ovens (Click on picture)

SEMICONDUCTOR
High production with exacting temperature and atmosphere control. The fastest and most efficient production furnaces available for high-temperature semiconductor and thick-film processing.  High production yields and through put are achievable due to the design's quick start-up and change over time, precise and repeatable temperature profiles up to 1000C.

RTC MCM/FPD Furnaces and Ovens (Click on picture)

MCM/FLAT-PANEL-DISPLAY/
ENCAPSULANT/CURING

A key characteristic of these systems (one that is critical to both the MCM and FPD industries) is extremely low particulates in the heating chambers.  20 particles per cubic foot of particulates 0.3 microns or larger is routinely achieved in the D Series, while 10 particles per cubic foot or less is obtained in the advanced ICO Series "Ultra Clean" Curing Oven.

MICROELECTRONICS  PV/SOLAR CELL
RTC Microelectronic Furnaces and Ovens (Click on picture)

MICROELECTRONICS
The Chamber construction, gas controls, and exhaust are designed to control in-process atmosphere by maintaining equilibrium between input exhaust and leakage.  Typical performance allows furnace induced gaseous contaminants to be held at or below 150 ppm using either oxidizing or inert atmospheres. 

RTC Solar Cell Furnaces and Ovens (Click on picture)

PV/ SOLAR CELL
RTC is the World leader in furnaces used by the PV (Photovoltaic) industry for front and back-side contact firing. A combination of the advantages of short wavelength infrared heaters and the uniformity and repeatability of the heating chamber provides PV manufacturers with extremely high production rates and product yields.

TECHNOLOGY 
INFRARED HEATING

IR heating, unlike convection heating, provides heat directly to objects without first heating the surrounding air. IR waves excite molecules within a substance (thus generating heat) but pass, generally undisturbed through the surrounding atmosphere. Other substances such as glass, ceramics and some organic materials are also transparent to IR waves. Objects suspended in these media can, therefore, be heated directly by IR waves without directly heating the supporting media. RTC is currently using two types of infrared heating, near infrared and medium-range infrared. Near infrared furnaces can reach temperatures up to 1000C, while mid-range infrared furnaces are able to reach temperatures up to 1300C.

ULTRAVIOLET HEATING

The simultaneous placement of UV and Infrared heating lamps inside the same furnace chamber is a new, patent pending, RTC technology that will work to temperatures as high as 1000C. This highly sophisticated system incorporates separate cooling and electrical systems. Depending upon installation specifications, the cooling jackets support either air or water cooling. The special mercury vapor lamps inside cooling jackets supply the UV radiation.

CONVECTION HEATING

This unique configuration is supplied to perform heat transfer through the indirect transmission of heated gas. In this type of furnace, the heating chamber temperature is maintained by heating the surrounding air. Convection is regularly used in surface mount reflow soldering when the components are different sizes. In this configuration, IR lamps are used to heat a metal chamber through which air is circulated. Currently RTC convection furnaces operate to temperatures as high as 600C.

CONDUCTION HEATING

In some applications, conduction heating is more desirable. RTC furnaces can be configured to run in conduction operations where the standard IR heating lamps are placed below the conveyor belt only. A special high-density conveyor belt is cycled through the heating chamber to block the transmission of the IR radiation and absorb the transmitted energy. The energy output from the lamps is transferred directly to the conveyor belt itself. Any product in direct contact with the conveyor belt will absorb the stored heat energy via conduction. Two additional conveyor systems are used independently to avoid heat loss that would occur while the conveyor belt is in the cooling section and any baffle modules.  

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Last modified: 2016-08-22