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RADIANT TECHNOLOGY CORP.

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SEMICONDUCTOR OVENS
D-SERIES  EFC-SERIES 

RTC D-Series Oven (Click on picture)

RTC D-SERIES OVENS
The D-Series of infrared convection ovens are designed for processes requiring close control of both temperature and atmosphere.  Primarily intended for thick film drying, adhesive and epoxy curing, these ovens can also perform many other lower temperature processes requiring air and nitrogen operating atmospheres. 

RTC EFC-Series Oven (Click on picture)

RTC EFC-SERIES OVENS
Enhanced Forced Convection reflow soldering system is designed for today's SMD manufacturing environment which demands, high yields in high volume production, low operating and maintenance costs, simplified operation with less operator attention, and greater flexibility with fewer required profiles. 

SMD-SERIES 
RTC SMD-Series Oven (Click on picture)

RTC SMD-SERIES OVENS
RTC furnaces provide exceptional forced air environmental control.  Internal positive pressure, baffle gates, and air curtains prevents the over all process from being influenced by outside disturbances. RTC systems are equipped for compressed air or nitrogen use.  

SEMICONDUCTOR FURNACES
AG-SERIES  H-SERIES 
RTC AG-Series Furnaces (Click on picture)

RTC AG-SERIES FURNACES
Single and two stage silver-glass die attach profiles, as well as solar-cell and green tape drying and firing sequences, are supported. Temperature up to 1000C, multistage temperature profiles, rapid removal of volatiles with multiple intermediate exhausts.

RTC H-Series Furnaces (Click on picture)

RTC H-SERIES FURNACES
H-Series combines all the necessary components for hydrogen operation with the normal operation of a furnace.  Special warm up and cool down procedures are implemented along with methods for preheating the hydrogen atmosphere as enters into the furnace interior.  

HT-SERIES  LA-SERIES 

RTC HT-Series Furnaces (Click on picture)

RTC HT-SERIES FURNACES
The HT-Series furnace operates in mid-range infrared by combining both infrared and ultra-violet heating elements.  The combination of these two enables the furnace to reach temperatures of up to 1300C.. 

RTC LA-Series Furnace (Click on picture)

RTC LA-SERIES FURNACES
An extremely versatile, general-purpose laboratory furnace used for experimental, prototype, or low-volume processing.  Its flexibility, temperature range, controlled-atmosphere capabilities, availability of options, and process applications are similar to larger models. 

S-SERIES  WB-SERIES 
RTC S-Series Furnaces (Click on picture)

RTC S-SERIES FURNACES
The fastest and most efficient production furnaces available for high-temperature semiconductor and thick-film processing.  
High production yields and through put are achievable due to the design's quick start-up and change over time, precise and repeatable temperature profiles up to 1000C..

RTC WB-Series Furnaces (Click on picture)

RTC WB-SERIES FURNACES
The Wafer Bump series of continuous conduction ovens are designed especially for advanced semiconductor wafer bump reflow.  The conduction heating principle provides efficient, rapid and accurate methods of heating and controlling the temperature of the wafers during the thermal process steps.

TECHNOLOGY 
INFRARED HEATING

IR heating, unlike convection heating, provides heat directly to objects without first heating the surrounding air. IR waves excite molecules within a substance (thus generating heat) but pass, generally undisturbed through the surrounding atmosphere. Other substances such as glass, ceramics and some organic materials are also transparent to IR waves. Objects suspended in these media can, therefore, be heated directly by IR waves without directly heating the supporting media. RTC is currently using two types of infrared heating, near infrared and medium-range infrared. Near infrared furnaces can reach temperatures up to 1000C, while mid-range infrared furnaces are able to reach temperatures up to 1300C.

ULTRAVIOLET HEATING

The simultaneous placement of UV and Infrared heating lamps inside the same furnace chamber is a new, patent pending, RTC technology that will work to temperatures as high as 1000C. This highly sophisticated system incorporates separate cooling and electrical systems. Depending upon installation specifications, the cooling jackets support either air or water cooling. The special mercury vapor lamps inside cooling jackets supply the UV radiation.

CONVECTION HEATING

This unique configuration is supplied to perform heat transfer through the indirect transmission of heated gas. In this type of furnace, the heating chamber temperature is maintained by heating the surrounding air. Convection is regularly used in surface mount reflow soldering when the components are different sizes. In this configuration, IR lamps are used to heat a metal chamber through which air is circulated. Currently RTC convection furnaces operate to temperatures as high as 600C.

CONDUCTION HEATING

In some applications, conduction heating is more desirable. RTC furnaces can be configured to run in conduction operations where the standard IR heating lamps are placed below the conveyor belt only. A special high-density conveyor belt is cycled through the heating chamber to block the transmission of the IR radiation and absorb the transmitted energy. The energy output from the lamps is transferred directly to the conveyor belt itself. Any product in direct contact with the conveyor belt will absorb the stored heat energy via conduction. Two additional conveyor systems are used independently to avoid heat loss that would occur while the conveyor belt is in the cooling section and any baffle modules.  

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Last modified: 2016-08-22