HOME ] UP ] FEEDBACK ] CONTENTS ] SEARCH ]
Corfin Tinning

Accupr. Probe Card ] Auer Services ] [ Corfin Tinning ] Wire Bond ]
SITE LINKS

 

 

banner_corfin2b1.jpg (7207 bytes)

banner_corfin1a2.jpg (3369 bytes)
ABOUT CORFIN AUTOMATION
Corfin Customer Service Corfin three (3) primary business areas are:

trim, form and tinning of fine-pitch high-reliability surface mount devices
tinning only of DIP, SIP, PLCC, LCC, PGA, Microwave and Hybrid devices
reclamation of product which is no longer solderable due to extended shelf-life corrosion

Corfin services the Commercial, Military, Aerospace, Consumer Electronics and Telecommunications Industries.

Corfin Industries LLC is an ISO 9002 certified trim, form and tinning facility which processes product for companies which seek expertise in outsourced services or cannot justify the capital investment.


Your browser is not Java capable or Java has been disabled.

The facility is certified to MIL-I-45208 and processes product to MIL-STD-2000A and MIL-PRF-38535.

All Corfin Industries equipment is calibrated to MIL-STD-45662 and we maintain an ESD program to MIL-STD-1686.

Corfin Production State Of The Art Facility
  • Engineering for special applications
  • 100% tracking of product through process
  • ESD protective floor & constantly monitored work stations
  • Temperature and humidity controls
  • Smocks, wrist straps, heel straps and finger cots
Corfin Component Expertise
  • Process flexibility for any type of component: fine pitch quad flatpacks, PLCC, SIP, DIP, LCC, Hybrid MCM, PGA, SOIC
  • 4 mil TAB devices
  • Devices processed to/from tube, trays, reels or bulk
Corfin Tinning Process Process Features
  • Nitrogen atmosphere eliminates icicling and bridging
  • PC CONTROLS FOR 100% REPEATABILITY
  • Trim & form in-line with tinning
  • Flat wave for tight solder coverage control +/-.003
Corfin Quality Control Certification Of Performance
  • Verification of trim & form dimensions including coplanarity
  • X-ray for solder thickness
  • Cross-section analysis
  • Fine & gross leak testing for hermetic packages
wb1385b.jpg (1873 bytes)

 

HOME ] UP ]
Send mail to info@bita.se with questions or comments about this web site.
Copyright 1998 BITA ELEKTRONIK SVENSKA AB 
Last modified: 2016-08-22