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TPT HB16

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TPT Franz Hickmann

TPT

TPT SEMI-AUTOMATIC BONDERS  WITH MOTORIZED Z-AXIS and Y-AXIS 

Model HB12, HB14 and HB16 Series of bench top size semi-automatic wire bonders with TFT touch panel and motorized Z and Y-Axis control are easy to operate pilot pre-production runs and small-scale production lines. One Bondhead (HB16) for bonding in Wedge/Wedge, Ball/Wedge or Bump bonding mode. No hardware change necessary (HB16). Direct access and simple adjustment to all bond parameters.

STANDARD FEATURES 


  HB12, HB14 and HB16 Series Semi-Automatic Wire Bonders

HB16D is combined Semi-Automatic Wire/Pick & Place Bonder

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90 Bonding Deep-Access Bond Head

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6.5" TFT Touch Panel Operation System

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PPL Ultrasonic Generator

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High/Low Ultrasonic Selection (1 or 2 watt)

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Large Bonding Area

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Stitch and Bump Bonding

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99 Program Storage Capability

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FDD 3.5" to store bonding programs

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Built-in Dual Fibre Optics Illuminator

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Built-in Heater Controller for Workholder

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Bond Arm Length 165 mm

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Motorized 2" Wire Spool

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Electronic Flame-Off and ball size control (for Ball Bonding)

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Semi-Automatic, Step and Manual Bonding Mode

OPTIONS 
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H10 Zoom Stereo-Microscope Leica S6-20x

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H20 Built in Heater Stage Controller (up to 250C)

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H12 Zoom Stereo-Microscope Leica MZ6 16x

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H21 100x100 mm square Adjustable Height Heated Workholder

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H26 60 mm round Adjustable Height Heated Workholder

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H29 90 mm round Adjustable Height Heated Workholder

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H43 Tool heater and Temperature Controller with LCD Display

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H50 Spotlight Targeting System

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H72 Wire Spool Adapter for 0.5" spool

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H73 Torque Wrench 25 cNm for exact tighten of bonding tool

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H90 Delivery with installation and user training

INFORMATION  
HB12 Wedge Bonder Data Sheet TPT HB12 Semi-Automatic Wedge Bonder
HB14 Ball/Bump Bonder Data Sheet TPT HB14 Semi-Automatic Ball/Bump Bonder
HB16 Wedge/Ball/Bump Bonder Data Sheet TPT HB16 Semi-Automatic Wedge/Ball/Bump Bonder
H80 The "Pick & Place/Die option  Data Sheet TPT HB16 Semi-Automatic Wedge/Ball/Bump Bonder

to TPT info page
WIRE/RIBBON CAPABILITY: BONDHEAD:
for Al wedge bonding 17m to 75m wire Deep-access (12mm)
for Au wedge bonding 17m to 75m wire CONTROL OF 1ST AND 2ND BONDPARAMETERS:
for Au ribbon bonding max. 25m x 250m Independent
for Au ball bonding 17m to 50m wire BONDING OPERATION PROCESS:
for Au bump bonding 17m to 50m wire Motorized Z axis (Bond Head) with table tear
 SPECIFICATION    HARDWARE 

Motorized Axis

Z-Azis (15mm) and Y-Axis (7mm)

Ultrasonic System

PLL control 62 kHz transducer

Wire Feed Angle

90 deep-access

Bondarm Length

165 mm

Control Panel

6.5 inch TFT Touch Panel

Loopheight and Profile

Programmable Loopheight and Profile

Storage capacity

100

Wire Termination

Bondhead and Table Tear

Wirespool handling

2 inch motorized

Fine Table Motion

10x10 mm

Mouse Ratio

6:1 ratio (optional 4:1 or 3:1)

Ultrasonic Power

0- 2 W output

Bond Time

15- 5'000 msec.

Bondforce

15- 100 cN

Heater Stage Controller

Built-in, 250 C max.

Lighting

Built-in Dual Fiber Optic Illuminator

Electrical Requirements

100- 240 V 10%, 50/60 Hz, 10 A  max.

Physical Dimensions

700 mm W x 650 mm D x 500 mm H

Weight

net 42 Kg

Industry Standards

CE certified

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Last modified: 2016-08-22