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TPT HB30

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TPT Franz Hickmann

TPT

TPT HEAVY WIRE BONDERS  

Model HB30 is a bench top size wire bonder, easy to operate and ideal for laboratories, pilot and pre-production runs and small scale production lines. Easy operation with TFT Touch Panel Operator System. Direct access and simple adjustment to all bond parameters and programs.

STANDARD FEATURES 


  HB30 Heavy Wire Bonder

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125m to 500m Aluminum Wire

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6.5" TFT Touch Panel Operation System

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100 Program Storage Capability

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Built-in Dual Fibre Optics Illuminator

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Motorized Z axis Bond Head

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Motorized Y travel travel for Step-Back loop control

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6:1 ratio Y-Y manipulator

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FDD 3.5" to store bonding programs

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Loop Profile Programmable

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Stitch Bonding

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Semi-Automatic, Step and Manual Bonding Mode

OPTIONS 
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H10 Zoom Stereo-Microscope Leica S6-20x

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H12 Zoom Stereo-Microscope Leica MZ6 16x

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H21 100x100 mm square Adjustable Height Heated Workholder

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H26 60 mm round Adjustable Height Heated Workholder

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H29 90 mm round Adjustable Height Heated Workholder

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H50 Spotlight Targeting System

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H51 Manual Z control

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H60 Bonding Tool (specify wire diameter)

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H73 Torque Wrench 25 cNm for exact tighten of bonding tool

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H90 Delivery with installation and user training

INFORMATION  
HB30 Heavy Wire Bonder Data Sheet TPT HB30 Heavy Wire Bonder
to TPT info page
 SPECIFICATION    HARDWARE 

Ultrasonic System

PPL US System

Ultrasonic Power

14 watt output

Bond Time

15- 2000 msec.

Bond Force

15- 1100 cN

Aluminum wire diameter

125m to 500m

Wire Termination

Front Cut

Wire Feed Angle

90

Motorized Y Travel

Step-Back up to 7 mm

Motorized Z Travel

15 mm

Fine Table Motion

15 mm

Mouse Ratio

6:1 ratio (optional 4:1 or 3:1)

Electrical Requirements

100- 240 V 10%, 50/60 Hz, 10 A  max.

Physical Dimensions

680 mm (27")W x 640 mm (25")D x 490 mm (19")H

Weight

net 50 Kg

Industry Standards

CE certified

 SPECIFICATION    SOFTWARE

Program Storage

100 programs

Loop Height

Programmable

Loop Profile

Programmable

 SPECIFICATION    PERFORMANCE

Automation

Semiautomatic

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Last modified: 2017-11-09